News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a solder paste droplet ejection apparatus, patterning system having the same, and control method thereof.
"A solder paste is a core material used to form a solder bump for mounting a device onto a PCB. In general, examples of methods of forming the solder bump are an electroplating method, an inkjet method, a screen printing method, etc.
"Among these methods, the inkjet method is a widely used method in MEMS, a semiconductor process, etc., in addition to a printer, and, in particular, plays a very important role in an operation of forming a bump during a circuit patterning and electronic packaging process using metal ink.
"However, in order to meet demands of high densityA figure of merit usually expressed in Joules per cubic inch for capacitors, small-sized, and high performance electronic devices, in particular, a nano-patterning method capable of dramatically reducing a nano-patterning operation, and controlling a bump size and a pitch interval minutely at a nano-level is needed.
"The conventional nano-patterning technologies that meet such demands are a dip-pen using method and a nano-inkjet method disclosed in Korean Patent Laid-Open Publication No. 2010-0043542 (laid-open published on Apr. 29, 2010).
"However, these methods are not suitable for forming a pattern of a uniform size such as a solder ball.
"That is, since the dip-pen using method performs patterning by supplying ink to a tip, a continuous process is impossible, which is problematic in the mass production, and the ink-jet method enables nano-level patterning, whereas it takes long time to perform the ink-jet method."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "The present invention has been made in an effort to provide a solder paste droplet ejection apparatus capable of performing a patterning process by continuously ejecting solder paste droplets.
