LED chip and component maker SemiLEDs Corp of Hsinchu, Taiwan says that EDN (Electronic Design News) has named its newest line of white chip-scale packages, the ReadyMount Enhanced CSP (EC) series, as one of the ‘Hot 100 Products of 2014’. Chosen by EDN’s editors and readers, the 2014 EDN Hot 100 recognizes the electronics industry’s most significant products of the year based on innovation, significance, usefulness, and popularity.
Launched in August, the ReadyMount Enhanced CSP combines SemiLEDs’ Enhanced Flip chip (EF) approach with its ReadyWhite phosphor technology. The EC delivers flexibility, reliability and manufacturability in a single 1.4mm x 1.4mm low-profile device. The glass top surface is also mechanically robust, and is not prone to the handling damage or stresses faced by wire-bond or flip chips with a silicone covering. The typical 145° field of view also demonstrates good color-over-angle characteristics as a result of the ReadyMount technology, says SemiLEDs. Enabling extremely high lumen density with its rated input power of up to 3W, the EC is a fully packaged white emitter SMD component, ready for surface mounting on any board-level module or COB application. The complete white chip solution eliminates the need for complex package-level phosphor application, lowering capital costs and simplifying manufacturing configurations.
SemiLEDs says that the EC series is suitable for general lighting applications including indoor and outdoor lighting, architectural lighting, and torches/flashlights. The rugged architecture and compact size of the single white die are additionally suited to mobile device flashes and LCD backlighting applications, adds the firm.
SemiLEDs’ CSP series of LED chips is RoHS compliant, with production quantities available now.
