PCB manufacturers are being offered a technique for flash/HIPOT (2kV) testing of unpopulated boards.
Clare has developed a system using its HAL104 instrument connected to a test enclosure for flash testing of PCBs during the initial production stages.
The enclosure has a conductive foam base with modular sections to accommodate different sizes of PCBs. It can have either a spring mounted probe system or a further section of conductive foam can be added to allow it to work with different types of PCBs.
According to the company, it is seeing a trend for all base PCBs to be flash tested during the manufacturing process to ensure that they have no defects and are compliant with safety standards.
"Electronics manufacturers want to ensure that component parts are capable of withstanding the voltages that final assembled products will operate to," said Richard Williams, senior applications engineer, Clare.
"Some manufacturers in the UK and China have already adopted this approach for their PCBs, while others are expected to follow to suit," said Williams.
Two types of PCB can be tested: those with one surface covered in metal and 'standard' units with an insulated side.
Regardless, the track side of the PCB is placed face down on the conductive foam, enabling all metallic parts to be in contact with the foam and providing a 'base bed' for the remainder of the insulating surface of the board. Once in position, a flash test is then performed across the board, testing for integrity.
The HAL104 tester incorporates AC/DC Hipot, insulation, ground bond testing to 40A, load testing up to 20A (5kVA) with leakage measurements from 100μA to 20mA, with 10μA resolution.
