Skyworks Solutions Inc of Woburn, MA, USA (which manufactures high-reliability analog and mixed-signal semiconductors) says that several OEMs and smartphone providers are leveraging its SkyOne front-end solution.
The SkyOne platform, which integrates all RF and analog content between the transceiver and antenna, reduces complexity, size and time-to-market for customers with demanding architectures for advanced mobile applications, says the firm. SkyOne is the world’s first semiconductor device to condense multiband power amplifiers and high throw switches along with all associated filtering, duplexing and control functionality into a single, ultra-compact package. Furthermore, adds the firm, the solution provides the world’s best linearity and power added efficiency for smart RF integration.
“Consumer demand for increasingly thinner mobile platforms with increased talk and data access time is creating unprecedented analog and RF complexity as well as harmonic coexistence issues. Skyworks is delighted to solve this system challenge with our breakthrough SkyOne platform,” said Liam K. Griffin, executive vice president and corporate general manager at Skyworks. “SkyOne is a proven architecture that optimizes performance beyond what is possible with existing approaches and incorporates all 2G, 3G and 4G/LTE protocols enabling seamless global roaming and extended battery life. Incorporating Skyworks’ arsenal of tested and patented technologies and leveraging GaAs, SOI, SiGe and CMOS processes, SkyOne can be modulated and customized depending upon the system requirements and roadmaps of each OEM.”
SkyOne solutions incorporate the field proven SKY77619, Skyworks’ high efficiency, multimode power amplifier module already in volume production with multiple customers.
Sampling now, these second generation, hybrid, multimode, multiband, patented front-end modules with low insertion loss support 2.5/3G/4G handsets and operate in quad-band GSM, GPRS, EDGE, WCDMA, HSPA and LTE modes. The 7 x 9.8 x 1.05 millimeter packaged FEMs consist of a GSM800/EGSM900 power amplifier block (PA), a DCS1800/PCS1900 PA block, separate WCDMA blocks operating in the low and high bands, logic control block for multiple power control levels as well as band-enable functions in cellular and universal mobile telecommunications system. Radio frequency I/O ports are internally matched to minimize external components while extremely low leakage current maximizes handset standby time. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in plastic overmold.
