Trade Resources Industry Views EVG Achieves Fourth Consecutive Triple Win in Vlsiresearch Customer Satisfaction Survey

EVG Achieves Fourth Consecutive Triple Win in Vlsiresearch Customer Satisfaction Survey

For a fourth consecutive year, EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has earned all three awards resulting from VLSIresearch Inc's annual Customer Satisfaction Survey. For 2016, EVG was ranked as one of the '10 BEST Focused Chip Making Equipment Suppliers' (having steadily increased its overall ratings since 2013) and one of 'THE BEST Suppliers of Fab Equipment' (for the 14th consecutive year). EVG also received a 'RANKED 1st award' in the 'Specialty Fab Equipment' category.

According to VLSIresearch, EVG excelled in the supplier performance categories, which include trust in supplier, technical leadership, recommended supplier, partnering and commitment. Moreover, EVG scored well across the board, increasing its scores in eight of the 15 total categories. In particular, this is the fourth year in which EVG was the highest-ranked supplier of wafer bonding equipment.

"EVG continues to rank highly and grow its position on our annual survey, thanks to its strong, global customer-focused strategy," comments VLSIresearch's CEO & chairman G. Dan Hutcheson. "The company's approach integrates an emphasis on high-volume manufacturing with its long-running commitment to technology invention, innovation and implementation. The results of our annual survey exemplify EVG's continued success in delivering leading wafer bonding and lithography solutions," he adds.

For this year's survey, VLSIresearch received feedback from more than 95% of the chip market and 80% of subsystems customers. Participants were asked to rate equipment suppliers among 15 categories based on three key factors: supplier performance, customer service, and product performance. A total of 3619 surveys were returned, resulting in 54,282 total responses.

Source: http://www.semiconductor-today.com/news_items/2016/jun/evg_2100616.shtml
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