EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment, has introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.
The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding (TB/DB) systems (UV laser debonding and multilayer adhesive debonding) in addition to EVG's ZoneBOND technology, which has already been implemented into production across the compound semiconductor and advanced packaging markets. EVG's LowTemp debonding platform is complemented by a supply chain of seven material suppliers, with a wide choice of qualified adhesives that support a variety of bonding applications and offer greater process flexibility for customers, says the firm.
Paul Lindner, EVG's executive technology director, said: "The experience and know-how that we've built up from our numerous installations in high-volume manufacturing has taught us that one solution doesn't fit all applications when it comes to temporary bonding/debonding. Accordingly, EVG offers highly flexible and modular equipment, a wide choice of qualified materials to support customers' individual requirements and multiple source policies, and process development and implementation support through our worldwide application labs and cleanroom infrastructure across a range of applications—including interposers, stacked memory, memory on logic, power devices and compound semiconductors."
The LowTemp debonding platform is available on EVG's full line-up of TB/DB systems, including the recently announced EVG850TB/DB XT Frame high-volume production platform, which can achieve a throughput of more than 40 wafer stacks per hour and features an optional, integrated in-line metrology module that takes up to 300,000 measurement points to enable real-time monitoring of the bonding/debonding.
