The TOWA Corporation of Japan, which supplies packaging (molding and singulation) equipment for the semiconductor, electronics and LED industries, has expanded its activities in Europe with an Innovation Center for Packaging Development via the establishment of the subsidiary TOWA Europe B.V. of Duiven,The Netherlands.
Europe has become a region where special ICs and electronic applications are being developed and produced, such as sensors, MEMS, vision applications and specific ICs, in particular for semiconductor, automotive and medical applications, says TOWA.
In 2004 TOWA Europe GmbH was established to serve European customers. Activities originally consisted of supplying TOWA encapsulation equipment, after-sales service, and spare parts. However, in addition to this, cooperation with the package/product development centers of European customers and European institutes became an important activity, and TOWA Europe started to play a leading role in the development of new products.
To further expand this, TOWA has hence decided to establish a Packaging Development Center in Duiven, The Netherlands, for which TOWA Europe B.V. has been founded.
A fully equipped laboratory with two TOWA molding systems, test & measuring equipment and an engineering department is available to give full support in all the phases of product development, from initial concept up to test, qualification and industrialization. The Dutch-, German- and English-speaking staff can assist European customers in the process of new package development. In addition, the new facility is also home to the European Marketing, Sales and Service department for TOWA systems, notes the firm.
