Abstract: A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitorsThe main differences between ceramic dielectricThe insulating material between the plates of the capacitor. The material is chosen for its ability to permit electrostatic attraction and repulsion to take place across it. The material will have the property that energy required to establish an electric field is recoverable in whole or in part, as electric energy. In other words, a good dielectric material is a poor conductor of electricity while being an effective supporter of electrostatic fields. types are the temperature coefficient of capacitanceThat property of a system of conductors and dielectrics which permits the storage of electricity when potential difference exists between the conductors. Its value is expressed as the ratio of a quantity of electricity to a potential difference. A capacitance value is always positive., and the dielectricThe insulating material between the plates of the capacitor. The material is chosen for its ability to permit electrostatic attraction and repulsion to take place across it. The material will have the property that energy required to establish an electric field is recoverable in whole or in part, as electric energy. In other words, a good dielectric material is a poor conductor of electricity while being an effective supporter of electrostatic fields. loss.Ceramic capacitors tend to have low inductance because of their small size. each of which includes a multilayer body in which a plurality of dielectricThe insulating material between the plates of the capacitor. The material is chosen for its ability to permit electrostatic attraction and repulsion to take place across it. The material will have the property that energy required to establish an electric field is recoverable in whole or in part, as electric energy. In other words, a good dielectric material is a poor conductor of electricity while being an effective supporter of electrostatic fields. ceramic sheets and a plurality of substantially planar inner electrodes are stackedMultiple capacitor elements stacked in multi-unit arrangement to provide bulk capacitance and lower ESR.Multiple capacitor elements stackedMultiple capacitor elements stacked in multi-unit arrangement to provide bulk capacitance and lower ESR. in multi-unit arrangement to provide bulk capacitance and lower ESR. on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes.
The surface of the multilayer body is mounted on a circuit board and includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other.
