Wafer foundry houses in China have stepped up efforts to develop Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production, compared to the Fin Field-Effect Transistor (FinFET) ...
Tags: Insulator, Semiconductor, high density chips
28nm is still the last node of Moore’s Law, says Zvi Or-Bach of MonolithiC 3D Inc., who beats the drum for monolithic 3D. “Samsung and smartphones in general look to be in trouble and that’s bad news for the electronics ...
Tags: Moore's Law, monolithic 3D, smartphones
Apple’s range of Mac computing products could soon be powered by processors designed in Cupertino, according to a new report on Wednesday. According to the analysts at KGI Research (via 9to5Mac) the company wants to upscale the ...
Tags: Apple, Consumer Electronics, Macs
At the SEMICON West 2014 trade show in San Francisco (8-10 July), process control and yield management solutions provider KLA-Tencor Corp of Milpitas, CA, USA launched four new systems - the 2920 Series, Puma 9850, Surfscan SP5 and eDR-7110 ...
Tags: KLA-Tencor, IC Technologies
FinScale Inc of Livermore, CA, USA, which develops and licenses device and process innovations for the semiconductor industry, has announced availability of its qFinFET technology, a next-generation 3D MOSFET architecture and manufacturable ...
Agilent Technologies Inc of Santa Clara, CA, USA has announced several innovations for the 2014 release of its suite of device modeling and characterization software tools. The suite comprises the Integrated Circuits Characterization and ...
Tags: GaN HEMTs, 3D Finfets
Last week nanotechnology research institute imec of Leuven, Belgium celebrated its 30th anniversary. Founded in 1984 as a non-profit organization, imec has grown to be a multi-disciplinary expertise center in the fields of semiconductor ...
Tags: FinFETs, III-V CMOS, ASML of Veldhoven, TSMC
Engineers at Imec and IBM have independently developed new manufacturing processes for making the next decade's leading chips, they revealed late last year. These efforts will allow the marriage of silicon wafers and certain exotic ...
Tags: Electrical, Electronics
At the IEEE International Electron Devices Meeting (IEDM 2013) in Washington D.C., USA (9-11 December), nanoelectronics research institute imec of Leuven, Belgium reported the first functional strained germanium (Ge) quantum-well channel ...
Tags: FinFETs III-V CMOS, Electrical, Electronics
By using a unique silicon fin replacement process, Imec of Leuven, Belgium has demonstrated what it claims are the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers. The nanoelectronics ...
Tags: FinFETs III-V CMOS, Electrical, Electronics
UMC will use IBM's support and knowledge to improve its internally developed 14nm FinFET Semiconductor company United Microelectronics (UMC) has joined IBM Technology Development Alliances to develop 10nm CMOS process technology. As ...
Tags: IBM, CMOS Process
Intel on Tuesday showed the first smartphone based on its next Atom smartphone chip code-named Merrifield, which will provide better performance and battery life than current Atom chips. The Merrifield chip will offer 50% better ...
Tags: Intel, Merrifield-Based Smartphone
Intel has released details about its forthcoming i-series microprocessors, dubbed "Haswell", which it claims will feature radically reduced power consumption. The details cover the high-end quad-core Core i7 and Core i5 microprocessor ...
Tags: Intel, Haswell PC, Microprocessor
The seesaw mobile processor battle between ARM and Intel continued at Computex, with ARM claiming it offered better performance per watt for mobile devices than Intel's upcoming chips. ARM's processors go into most smartphones and ...
As Intel mulls a plan to expand its contract-manufacturing operations, the company has lost ground as the world's top semiconductor company to chip suppliers benefitting from the success of mobile devices, according to a study by IC ...