Dow Performance Silicones has introduced new non-migrating silicone additive for bi-axially oriented polypropylene (BOPP) film. The new Dow Corning HMB-6301 Masterbatch is a patent-pending solution, which will facilitate packaging ...
Tags: silicone additive, BOPP film
GlobalFoundries of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with more than 250 customers and operations in Singapore, Germany and the USA) has announced its vision and roadmap for a range of technology ...
Tags: semiconductor, wireless networks
Electronics For Imaging (EFI) will exhibit at SGIA Expo how signage and graphics businesses can gain productivity and profitability advantages with a broad portfolio of digital production products, including the new EFI Pro 24f true flatbed ...
Hub Folding Box has chosen the EFI Packaging Suite from Electronics For Imaging (EFI), US, as its next-generation workflow solution. The EFI Packaging Suite features Radius ERP software as its core ERP technology. Hub Folding Box has ...
Tags: Hub Folding Box, EFI Packaging
Fabless silicon photonics system-on-chip (SoC) company Skorpios Technologies Inc of Albuquerque, NM, USA has acquired Novati Technologies LLC, a semiconductor integration company with a fabrication plant in Austin, TX. Skorpios delivers ...
Fujifilm is all set to unveil Inca SpyderX, a UV wide format press, and other advanced inkjet innovations at the upcoming SGIA Expo 2017 to be held in New Orleans, Louisiana. FUJIFILM North America Corporation, Graphic Systems Division ...
Tags: Fujifilm, SGIA Expo 2017
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has shipped multiple TurboDisc EPIK 868 gallium nitride (GaN) metal-organic chemical vapor deposition (MOCVD) systems to several leading Chinese ...
Tags: LED Production, LED
Source Photonics Inc of West Hills, CA, USA (which provides broadband access optical components and modules) and the Jintan Economic Development Zone have announced the establishment of a new optical laser production plant in Jintan, China. ...
Tags: MOCVD, Source Photonics
SAKATA INX and its subsidiary INX International Ink are exhibiting narrow web label, sleeve and flexible packaging ink products, UV, EB and low migration inks and coatings and digital printing technologies, at Labelexpo Europe to be held in ...
Pro Mach’s subsidiary Orion will showcase a range of stretch wrapping solutions at the Pack Expo event in Las Vegas, US. The event will take place between 25 and 27 September. At the event, the company will showcase new AG360 ...
MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...
Tags: Die Bonder, Photonics
Packaging machinery and automated line supplier ULMA Packaging is set to showcase its latest high-speed technology during the Processing and Packaging Machinery Association (PPMA) event at the National Exhibition Centre (NEC) in Birmingham, ...
Tags: ULMA, ULMA Packaging, Packaging machinery
First Solar Inc of Tempe, AZ, USA, which makes thin-film photovoltaic modules based on cadmium telluride (CdTe) as well as providing engineering, procurement & construction (EPC) services, has released its annual sustainability report, ...
Tags: First Solar, PV module
For fiscal first-quarter 2018 (ended 1 July 2017), Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has reported revenue of $639.9m, down slightly on ...
Tags: Qorvo, IDP product
Midland Regional Printers will install Easymatrix to increase its die-cutting capacity at its Nottingham facility in the UK. The die-cutter is a 7,700 sph machine which can handle stocks of 90 to 2,000gsm (and corrugated up to 4mm ...