ON Semiconductor of Phoenix, AZ, USA – which supplies power management, analog, sensors, logic, timing, connectivity, discrete, system-on-chip (SoC) and custom devices – has extended its silicon carbide (SiC) diode portfolio by ...
In stand I-2 (hall 2) at GSMA’s Mobile World Congress (MWC2018) in Barcelona, Spain (26 February – 1 March), Skyworks Solutions Inc of Woburn, MA, USA (which makes analog and mixed-signal semiconductors) has launched its first ...
Tags: Skyworks, Wireless Communications
Custom Printed Products, a manufacturer of label and flexible packaging, has purchased a Mark Andy Digital One label press, to add digital capability to its business. The entry-level Digital One label press is designed for short and micro ...
Guala Closures Group is set to unveil new aluminum smart closure with near field communication (NFC) technology at the Unified Wine & Grape Symposium in the US. The event will take place from 23 to 25 January in Sacramento, California. ...
Tags: Wine Industry, Smart Closure
The global market for radio-frequency (RF) power semiconductor devices – spanning silicon (LDMOS), gallium arsenide (GaAs) and gallium nitride (GaN) – will increase at a compound annual growth rate (CAGR) of nearly 12% during ...
Tags: Semiconductor
PicoBrew has introduced PicoStill distilling device at CES 2018, elevating craft brewing For homebrewers and professional distillers. Licensed and properly permitted craft distillers or individuals can also use the PicoStill to produce a ...
Nissan said that will demonstrate its new brain-to-vehicle (B2V) technology at the upcoming CES 2018 to be held in Las Vegas, the US. The technology will allow vehicles to interpret signals from the driver’s brain and accelerate ...
Tags: Nissan, B2V technology, CES 2018
Packaging origination and graphics management company Contact Originators has invested in Esko XPS Crystal technology for the corrugate business. The firm is claimed to be the first in the UK in corrugated for its investment in Esko XPS ...
Tags: corrugate business, CDI imaging
Denso announced that it will exhibit at CES 2018 at the Las Vegas Convention and World Trade Center in Las Vegas, Nevada from Tuesday, January 9 to Friday, January 12, 2018. At the exhibition, DENSO will present its future of mobility and ...
German pharma packaging firm August Faller is set to showcase its smart packaging solutions at Pharmapack event in Paris, France. The event will take place between 7 and 8 February. At the event, the company will exhibit three smart ...
Tags: Smart Packaging, pharma packaging
Metrology and inspection equipment maker Lasertec Corp of Tokyo, Japan has launched the GALOIS defect inspection and review system series, designed specifically for the inspection and analysis of gallium nitride (GaN) wafers. The firm is ...
Tags: Metrology, inspection equipment
ROHM of Kyoto, Japan is to provide full-SiC (silicon carbide) power modules to the VENTURI Formula E team during season 4 (2017–2018) of FIA Formula E (the world’s first formula racing championship for all-electric vehicles), ...
Tags: Power Modules, silicon carbide
DS Smith Plastics business unit Rapak North America has introduced EvacuStrip dip strip technology beverage bag for bag-in-box packaging formats. The dip strip rigid and rectangular evacuation assistance device in the bag enables ...
Tags: Beverage Bag, packaging formats
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has won an ...
Tags: SPTS, GaN-on-SiC, LED
Advanced materials group firm Haydale is seeking patent in the UK for its PATit anti-counterfeiting technology designed for packaging market. The company filed a new patent application for the technology, which uses in-house software ...