“The SiC power business is concrete and real, with a promising outlook,” said Yole Développement in 2016. The trend has not changed in 2017, and the SiC industry is going even further as industrial players have increasing ...
Tags: SiC power, SiC devices
Ford has expanded the use of Microsoft’s HoloLens mixed reality technology to all of its global centers to speed up vehicle design. Ford designers can now wear a pair of wireless headsets to see several digital designs and parts, as ...
To keep pace with the dramatic size and weight reductions in laptop designs over the last 10 years, Navitas Semiconductor Inc of El Segundo, CA, USA has launched what it claims is the smallest 65W USB-PD (Type C) adapter reference design. ...
Tags: GaN Power, Laptop Adapter
Creative Edge Software plans to launch the iC3D v5.0 packaging design software at this month’s Labelexpo Europe label event in Brussels. In version 5.0 of iC3D, five major new features have been added by the software firm to expand ...
Osram Opto Semiconductors GmbH of Regensburg, Germany is expanding its existing portfolio for flash applications with a product featuring a specially developed chip-scale package (CSP). With Ceramos C, Osram is following the trend for ...
Tags: Osram, Mobile Devices
Sappi said it will showcase its complete line-up of speciality and packaging grades at this month’s Pack Expo Las Vegas in the US. The company's products and solutions will target packaging companies, brand owners, converters, ...
Tags: Sappi, Paper Packaging
Germany-based Zanders is set to exhibit new Zanpack touch perfume packaging design at the Packaging Innovations and Luxury Packaging London event in the UK. The event will take place from 13 to 14 September at Olympia in London. At the ...
Tags: Perfume Packaging, touch packaging, paperboard products
Packaging solutions provider CSP Technologies is expanding its Auburn manufacturing facility in Alabama, US for increased manufacturing and warehousing space. The manufacturing and warehousing capacity of the facility is being expanded by ...
Tags: Packaging, warehousing space
Ardagh Group is set to introduce new two-stage thermochromic solution, Reveal Impact, for aluminium cans. The new solution includes combined temperature-sensitive inks, which display the same color when cooled down. Reveal Impact uses ...
Tags: aluminium cans, inks
API is set to introduce new TA+ cold foil at this year’s LabelExpo Europe event in Brussels, Belgium. The event will take place from 25 to 28 September. The company has developed new cold foil for pack designers and printers to ...
The service has been devised by gaming industry veteran Cory Jones and will offer brand-new titles on a monthly basis. A new tabletop gaming subscription service is gearing up to hit Kickstarter, devised by gaming industry veteran Cory ...
Tags: Tabletop Gaming
Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has launched an asymmetric Doherty amplifier enabling ultra-high levels of power efficiency in the ...
Tags: Qorvo, GaN, RF, GaN-on-SiC
API said it will unveil research findings from its Package Insight study at the Packaging Innovations fair in London this September. The brand enhancement specialist says that its focus will be on products and services that can take ...
Electronics and Optoelectronic System Research Laboratories (EOSRL) under the Taiwan government-sponsored Industrial Technology Research Institute (ITRI) has cooperated with Avertronics to develop a human-centric smart ambient lighting ...
Pasternack Inc of Irvine, CA, USA (which makes both passive and active RF, microwave and millimeter-wave products) has launched a new line of E- and W-band PIN diode waveguide switches. The single-pole single-throw (SPST) and double-pole ...
Tags: Pasternack, Switches