Ghent University/IMEC in Belgium and X-Celeprint in Ireland/USA claim "the first III-V optoelectronic components transfer printed on and coupled to a silicon photonic integrated circuit" [Andreas De Groote et al, Optics Express, vol24, ...
Researchers based in Taiwan and USA have increased the modulation bandwidth of indium gallium nitride (InGaN) light-emitting diodes (LEDs) [Jin-Wei Shi, IEEE Electron Device Letters, published online 26 May 2016]. The enhanced bandwidth was ...
Italy's Toscotec has agreed to rebuild the dryer section of Smurfit Kappa Papelsa's paper machine (PM) 1 located at Barbosa mill in Colombia. The dryer section rebuild is expected to improve efficiency as well as increase operating speeds ...
Xidian University in China has used pulsed metal-organic chemical vapor deposition (MOCVD) to increase indium gallium nitride (InGaN) room-temperature channel mobility to 1681cm2/V-s, which is claimed to be a record [Yachao Zhang et al, ...
Integrated passive device maker OnChip Devices Inc of Santa Clara, CA, USA says that its wafer fabrication facility is offering backside metallization (BSM) of thin films for applications such as military, medical, and instrumentation. ...
Tags: Sputtering, HB-LEDs, GaN-on-Si, Wafer bonding
Sophia University in Japan has developed a technique for growing laser diodes on an indium phosphide (InP) layer bonded to silicon (Si) [Keiichi Matsumoto et al, Appl. Phys. Express, vol9, p062701, 2016]. The researchers claim that this is ...
Tags: Laser Diodes, Si Substrates
US-based biotechnology company DuPont Nutrition & Health has developed a new concept for European bread market inspired by Nordic thin breads. The concept, which is rich in healthy carbohydrates, targets consumers who are turning to ...
Tags: biotechnology, DuPont
Materials, component and precision system supplier Ferrotec Corp of Santa Clara, CA, USA (whose Temescal division of Livermore, CA, USA makes electron-beam-based evaporative coating systems) says that a Temescal UEFC series evaporator - the ...
At drupa, the stage will be set for Konica Minolta to officially launch KM-1, underscore its commitment to the label and packaging markets, unveil more plans in its cooperation strategy with MGI across the globe as well as break new ground ...
Tags: Konica Minolta, Drupa 2016
Researchers based in China, Singapore and Turkey have used an extremely thin layer of silicon dioxide (SiO2) insulator as a charge inverter in indium gallium nitride (InGaN) light-emitting diodes (LEDs), improving light output power and ...
Chien-Chung Lin, Huang-Yu Lin, Kuo-Ju Chen, Sheng-Wen Wang, Kuan-Yu Wang, Jie-Ru Li, Huang-Ming Chen and Hao-Chung Kuo The use of distributed Bragg reflectors in remote-phosphor white-LED packaging significantly improves luminous ...
Tags: White LED Packaging
Sappi is reinforcing the performance capabilities and benefits of its release liner portfolio with several investments and activities. Algro Sol silicone base papers from Sappi have had an outstanding reputation for quality during the ...
Tags: Sappi, Release Liner Business
Canada-based equipment manufacturer Macro Engineering and Technology has completed installation of an advanced cast extrusion lamination line at Raven Industries’ facility in Sioux Falls, South Dakota, US. Capable of processing ...
Tags: cast extrusion, Raven Industries
The US Department of Defense's Air Force Research Laboratory, Sensors Directorate, Devices for Sensing Branch (AFRL/RYDD) has issued a Request For Information (RFI) titled 'Development of Large Diameter Silicon Carbide Substrate and ...
Rearchers in China claim the first radio frequency (RF) switch device based on indium gallium arsenide (InGaAs)-channel metal-oxide-semiconductor field-effect transistor (MOSFET) technology [Zhou Jiahui et al, J. Semicond. 2016, vol37, ...
Tags: InGaAs MOSFET RF switch