Hub Folding Box has chosen the EFI Packaging Suite from Electronics For Imaging (EFI), US, as its next-generation workflow solution. The EFI Packaging Suite features Radius ERP software as its core ERP technology. Hub Folding Box has ...
Tags: Hub Folding Box, EFI Packaging
Fabless silicon photonics system-on-chip (SoC) company Skorpios Technologies Inc of Albuquerque, NM, USA has acquired Novati Technologies LLC, a semiconductor integration company with a fabrication plant in Austin, TX. Skorpios delivers ...
US-based Valvoline has introduced new Easy Pour Bottle for customers in the automotive industry. The company developed the new packaging to easily change oil, providing a simplified shopping solution for the automotive do-it-yourself ...
Esko has collaborated with a range of industry partners at this year’s Labelexpo Europe event in Brussels, Belgium. The company announced collaborations to offer services ranging project management, design and prepress to flexo ...
Flint Group is showcasing a portfolio of imagers, printing plates and equipment, sleeves, inks and digital printing solutions for the label and packaging industry at Labelexpo show in Brussels. The nyloflex Xpress Thermal Processing ...
Tags: Flint Showcases, UV
Epson America has introduced SurePress L-4533AW, a new product in the digital label press lineup. The L-4533AW delivers high-quality labels and packaging at a low total cost of ownership. The Epson MicroPiezo inkjet technology delivers ...
Tags: Epson, Digital Label Press
Oclaro Inc of San Jose, CA, USA (which provides components, modules and subsystems for optical communications) has announced volume production of its lithium niobate (LiNbO3) polarization-multiplexed quad Mach-Zehnder (PM-QMZ) modulators, ...
Tags: Oclaro, Niobate Modulator
To keep pace with the dramatic size and weight reductions in laptop designs over the last 10 years, Navitas Semiconductor Inc of El Segundo, CA, USA has launched what it claims is the smallest 65W USB-PD (Type C) adapter reference design. ...
Tags: GaN Power, Laptop Adapter
Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017. The new Truebump technology delivers quick, accurate and repeatable ...
Tags: Rudolph, Semicon Taiwan 2017
Pro Mach’s subsidiary Edson is set to introduce new robotic mixed-product case packing solution at the Pack Expo in Las Vegas, US. The solution is cliamed to offer the speed and flexibility needed for e-commerce fulfillment and food ...
Tags: food packing, tray packer
Bosch has revealed what it describes as a start-up powertrain for electric vehicles. It’s now common knowledge that a more powerful battery will increase an electric car’s range. But can a new powertrain have a comparable ...
Tags: electric vehicles, powertrain
X-Rite and its subsidiary Pantone have collaborated with ColorPartner to deliver color measurement solution for industrial inkjet applications. The solution will permit industrial printers to measure color on metallic, wood, plastic, ...
Tags: Industrial Inkjet, inkjet printing
X-Rite, Esko and AVT will display complete label and packaging solutions at Labelexpo in Brussels, Belgium, which is due to be held from September 25 to 28 2017. X-Rite, its subsidiary Pantone, and Esko will display the solutions at stand ...
ULMA Packaging has launched the patent-pending VTI640V vertical form fill and seal system (VFFS), a new packaging solution for herbs and leaf produce. The product will be pulled to the bottom of the bag, by the solution using a device, ...
Tags: ULMA Packaging, Packaging
PowerAmerica — a manufacturing institute consisting of public and private partners from the semiconductor industry, the US Department of Energy (DoE), national laboratories and academia — in early August selected Navitas ...
Tags: PowerAmerica, Fast Chargers