Siegwerk, a provider of printing inks for packaging applications and labels, has expanded its digital ink footprint by opening a new production facility for inkjet inks in France. The firm has expanded its technical center in Annemasse, ...
Tags: Siegwerk, packaging, printing inks
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA – which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications – has made available the ...
GaN Systems Inc of Ottawa, Ontario, Canada – a fabless developer of gallium nitride (GaN)-based power switching semiconductors for power conversion and control applications – has made available the GS61004B-EVBDC evaluation ...
Tags: GaN Systems, integrated circuits
M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has opened its Optoelectronics Customer Innovation Lab, with ...
Tags: semiconductors, analog RF
Ulma Packaging has introduced a new VFFS air extraction system (tight bag) for the food industry. The new tight bag system will allow manufacturers to tackle excess air in the bag, which frequently leads to bigger boxes resulting in fewer ...
Tags: Ulma Packaging, Food Industry
United Caps, a Luxembourg-based high performance cap and closure systems manufacturer, is set to acquire the plastic closures division of Closures4you. The acquired assets include 28mm caps for re-usable glass bottles as well as for ...
Tags: United Caps, Plastic
Hosting 383 exhibitors from 11 countries and areas namely Germany, Switzerland, Sweden, Czech, the U.S, Japan, South Korea, India, Taiwan, Hong Kong and China, Taiwan's most influential textile trade fair, 2017 Taipei Innovative Textile ...
Tags: Textile, Textile Market
Anokiwave Inc of San Diego, CA, USA – which provides highly integrated silicon core chips and III-V front-end integrated circuits for millimeter-wave (mmW) markets and active antenna based solutions – has launched the AWA-0134 ...
Tags: Anokiwave, integrated circuits
Fiber-optic communications component and subsystem maker Finisar Corp of Sunnyvale, CA, USA has introduced Flextune, a new hardware-configurable feature that simplifies deployment of dense wavelength division multiplexing (DWDM) ...
Dow Performance Silicones has introduced new non-migrating silicone additive for bi-axially oriented polypropylene (BOPP) film. The new Dow Corning HMB-6301 Masterbatch is a patent-pending solution, which will facilitate packaging ...
Tags: silicone additive, BOPP film
Mitsubishi Electric will be showcasing its EMIRAI 4 concept car featuring next-generation driving-assistance technology, which can help reduce traffic accidents and contribute to a safe, convenient and environmentally friendly ...
Tags: Mitsubishi, Concept Car
Swedish automaker Volvo Cars and its parent company Geely Holdings will be investing €640m in their new electric vehicle brand Polestar. The investment will be used to establish a manufacturing facility in Chengdu, China which is ...
Tags: Volvo Cars, Geely, electric vehicle
Mazda Motor started production of the new CX-5 crossover at its Hofu Plant No. 2 in Yamaguchi Prefecture to meet the growing global demand for crossovers. Until now the CX-5 has been produced at the company’s Hiroshima Plant and at ...
Tags: Mazda Motor, CX-5 crossover
StePac, a UK-based subsidiary of Johnson Matthey’s, has introduced new fresh produce packaging solutions for retail industry StePac has launched Xgo retail packaging solutions for whole fruits, vegetables and fresh herbs, as well as ...
Tags: StePac, Packaging, Retail Industry
Private equity firm Genstar Capital has acquired US-based Tekni-Plex from American Securities for an undisclosed sum. Based in Wayne of Pennsylvania, Tekni-Plex produces products, components and materials for healthcare, specialty ...
Tags: Genstar Capital, packaging