Dowa Holdings Co Ltd subsidiary Dowa Electronic Materials Co Ltd of Tokyo, Japan has developed a deep ultraviolet LED chip with dimensions of 1mm × 1mm and what is claimed to be the industry’s highest output power of 75mW at a ...
In hall B2, booth 350 at the Laser World of Photonics 2017 trade show in Munich, Germany (26–29 June), Berlin-based Ferdinand-Braun-Institut, Leibniz-Institut für Hochstfrequenztechnik (FBH) – which offers the full value ...
Tags: FBH, UV LED Developments
South Korea's Samsung Electronics Co Ltd has begun mass producing a new mid-power LED package, the LM301B (with samples available now), featuring what is claimed to be the industry’s highest luminous efficacy of 220 lumens per watt. ...
Osram Opto Semiconductors GmbH of Regensburg, Germany has produced a broad-area laser diode with a lateral brilliance of up to 4.8W per millimeter and milliradiant (W/(mm*mrad)) in the laboratory. The more brilliant the laser, the more ...
Tags: Osram Opto, GmbH
The design for Apple’s A11 chip – the one intended for use on next year’s iPhone 8 – is already being finalised, apparently. That’s according to a report by technology industry news site DigiTimes, which ...
Acquisitions are an almost weekly occurrence in Silicon Valley, but Apple’s next scoop could be closer to home. Apple is said to be in “advanced talks” to buy Imagination Technologies, a UK-based chip design firm partly ...
We've received the strongest indication yet as to the identification of the chips bound for the forthcoming iPhone 5SE and iPad Air 3. Apple is said to be holding an event in mid-March to launch a new 4-inch smartphone in the iPhone 5SE, ...
Tags: iPhone 5SE, iPad Air 3
Cadence Design Systems Inc of San Jose, CA, USA has collaborated with Lumerical Solutions Inc of Vancouver, BC, Canada and PhoeniX B.V. of Enschede, The Netherlands to jointly develop an integrated electronic/photonic design automation ...
Emcore Corp of Alhambra, CA, USA, which provides indium phosphide (InP)-based optical chips, components, subsystems and systems for broadband and specialty fiber-optics markets, has expanded its range of laser diode and avalanche photodiode ...
Tags: optical chips, subsystems
In hall B1 (booth 403) at Laser World of Photonics 2015 in Munich, Germany (22-25 June), II-VI Suwtech of Shanghai, China – a subsidiary of engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA ...
Tags: Laser diodes, Electronics
In hall B1 (booth 403) at Laser World of Photonics 2015 in Munich, Germany (22-25 June), engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA – represented by its subsidiaries II-VI Suwtech of China ...
Apple has reportedly signed up rival tech firm Samsung as the lead manufacturer for its Apple Watch processor chips. According to Digitimes, Samsung is setting up to build several thousand 12-inch wafers per month using a 28nm ...
Tags: Samsung, Apple, Consumer Electronics
The LinkIt ONE development board, which aids in the easy prototyping of wearable and IoT devices, has been released by Seeed Studio. The board, which was designed for the MediaTek LinkIt Development Platform, was developed by Seeed Studio ...
Tags: wearable devices, IoT devices
Peregrine Semiconductor Corp of San Diego, CA, USA has unveiled a new line of UltraCMOS monolithic phase & amplitude controllers (MPAC) for Doherty amplifiers used in wireless base-station transmission. The company presented its devices at ...
Tags: Peregrine, Ultracmos Challenge
They successfully developed 560 mW high-power UV LED and their strategy is to take the dominant position in UV LED market which has a higher technical barrier. LG Innotech announced on the 20th that they succeeded in the development of a ...