IPak articles & resources on Made-in-China.com

Pro Mach's IPak to Introduce New Automatic Tray Former at Pack Expo Event in US

Sep 4, 2017

Pro Mach’s subsidiary IPak is set to introduce new automatic tray former for produce packers at this year’s Pack Expo event in the US. The event will take place from 25 to 27 in Las Vegas. The new IPak TF-330GH tray former ...

Tags: IPak, automatic tray former

Pro Mach to Showcase Packaging Solutions at Pack Expo

Nov 17, 2016

Pro Mach End of Line Group, powered by Pro Mach, will display solutions associated with case and tray forming, packing and sealing, bagging, bundling, shrink wrapping, stretch wrapping, and palletizing at Pack Expo scheduled to be held in ...

Tags: Pro Mach, Pack Expo

Pro Mac's IPak to Introduce New Tf-350b Tray Former Machine

Nov 10, 2016

Pro Mach subsidiary IPak Machinery is set to unveil the new TF-350B tray former machine at Pack Expo in the US. The event will take place from 6 to 9 November in Chicago. The new TF-350 family of tray formers produces different trays, ...

Tags: tray former machine, Pro Mach subsidiary

The Pro Mach End of Line Group Showcases at Pack Expo an Integrated End of Line Packaging System

Sep 22, 2015

The Pro Mach End of Line Group, showcases at Pack Expo Las Vegas 2015, September 28-30, a host of stand-alone and integrated systems from such brands as Brenton, Currie by Brenton, DEKKA, Edson, IPak, Orion, and Wexxar/BEL. The Pro Mach ...

Tags: integrated case packing, robotic palletizing, stretch wrapping line

IPak Machinery Launches New TF-100 Tray Former for 4-Corner Trays

Sep 14, 2015

IPak Machinery, a manufacturer of automatic tray formers powered by Pro Mach, has expanded its product range with the introduction of new TF-100 tray former. Designed for 4-corner trays where no rollover or 1-piece lidding is required, ...

Tags: IPak Machinery, Tray Former, 4-Corner Trays

Pro Mach Has Been Acquired by Affiliates of AEA Investors

Oct 29, 2014

Packaging machinery and integrated systems providers Pro Mach has been acquired by affiliates of AEA Investors (AEA) from The Jordan Company for an undisclosed amount. Pro Mach sells more than 25 equipment brands across the world. ...

Tags: Pro Mach, AEA Investors, Printing

Pro Mach Will Be Acquired by The Affiliates of AEA Investors From The Jordan Company

Sep 23, 2014

Packaging company Pro Mach will be acquired by the affiliates of AEA Investors from The Jordan Company for an undisclosed amount. Pro Mach manufactures packaging and processing equipment solutions and also provides training, installation, ...

Tags: PRO Mach, AEA Investors, Packaging

IPak Will Introduce Its New Servo-Driven TF-350 S-Series Tray Former

Aug 29, 2013

Packaging company Pro Mach’s brand IPak will introduce its new servo-driven TF-350 S-Series tray former, which delivers better speed, tray flexibility, and forming consistency in a simpler design. According to the company, the new ...

Tags: Tray Former, Packaging

Pro Mach Inc. Has Formed a New EOL Distributed Products Group to Enhance Sales

Feb 6, 2013

Pro Mach Inc. has formed a new End of Line (EOL) Distributed Products Group to enhance sales and marketing support for distributors selling its end of line products. Pro Mach's EOL brands primarily sold through specialty packaging ...

Tags: Pro Mach, Line Distributed Products Group, EOL

Mold New Distributed Products Group

Feb 5, 2013

Pro Mach has announced the formation of a new End of Line (EOL) Distributed Products Group in a bid to improve sales and marketing support for distributors selling its end of line products. The company's EOL brands sold mainly through ...

Tags: Pro Mach, Distributed Products Group, EOL

Toshiba Has Announced at The PCIM Exhibition in Germany a New Generation of SJ Mosfets

May 9, 2012

Toshiba has announced at the PCIM exhibition in Germany a new generation of superjunction(SJ)technology for power mosfets.The new DTMOS-IV process,which is being deployed in the company's latest family of high-speed,high-efficiency 600V ...

Tags: Toshiba, superjunction mosfets, new DTMOS-IV process

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