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Sun Chemical to Showcase Wide Product Portfolio for Printed Electronics at LOPEC 2018

Jan 23, 2018

Sun Chemical will showcase the latest offerings from its wide portfolio of solutions for printed electronics, displays, electroluminescent lighting, smart sensors, packaging, printed circuit boards and electronics manufacturing at LOPEC ...

Tags: Sun Chemical, LOPEC 2018

Osram Launches Osconiq LED Product Family for Professional Applications

Sep 8, 2017

Osram Opto Semiconductors GmbH of Regensburg, Germany says that its new Osconiq LED product line will cover professional applications including linear and area lighting, high- and low-bay lighting and street lighting. The familiar Duris P ...

Tags: Osram, LED Product

MRSI Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

Aug 23, 2017

MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...

Tags: Die Bonder, Photonics

Osram Launches First Multi-Chip LED with Lens Integrated Into Single Module, Targeting Camera Flash Applications

Jun 29, 2017

Osram Opto Semiconductors GmbH of Regensburg, Germany says that, for the first time, it has integrated two LED chips and a lens into a single module. The compact Oslux S 2.1 multi-chip LED gathers the firm’s technical expertise into a ...

Tags: Osram, LED chips

Graco Sells Ball Ground Aircraft Sealant Repackaging Business Assets to Royal Adhesives

Jun 13, 2017

CM Equity Partners's portfolio firm Graco Supply Company has divested the assets of the Ball Ground aircraft sealant repackaging business to Royal Adhesives & Sealants. Financial details of acquisition have not been disclosed by both the ...

Tags: Graco, Sealant Repackaging

Cambridge Nanotherm Addresses Thermal Management Challenge of CSP LEDs

Apr 7, 2017

Cambridge Nanotherm Ltd of Haverhill, Suffolk, UK, a producer of nanoceramic thermal management technology, says that its Nanotherm LC thermal management solution addresses the unique needs of chip-scale packaged (CSP) LEDs. CSP LEDs have ...

Tags: CSP LEDs, LEDs

Sinopec Cooperates with Farsoon to Develop 3D Printing Materials

Sep 28, 2016

On April 13, Sinopec Baling Petrochemical Company signed a Cooperation Framework Agreement with Farsoon High-Technology Co.,Ltd, which has a China’s only intelligent manufacturing demonstration project on 3D printing materials. ...

Tags: Sinopec Baling Petrochemical Company, Cooperation Framework Agreement

Singer Valve Launches Three New Deluge Valves for Hazard Areas

Jun 21, 2016

The three new valves include; the Electronic Operated Deluge Valve, the Pneumatic Operated Remote Control Deluge Valve and the Electric Pneumatic Operated Deluge Valve. These UL approved valves are used in high hazard areas where high ...

Tags: fire valves, Deluge Valves, suppression

RJR Ships 10 Millionth Air-Cavity Plastic Package, Highlighting Migration From Air-Cavity Ceramic Packaging for RF

May 20, 2016

RJR Technologies Inc of Oakland, CA, USA, a developer and high-volume manufacturer of air-cavity plastic (ACP) semiconductor packaging for RF and microwave markets, has shipped over 10 million ACP packages, reflecting the increasing use of ...

Tags: microwave packaging, Plastic Package

Lumileds Launches LUXEON XR-3020 Ultra-Slim Module To Speed Indoor Area Lighting Design

Mar 23, 2016

LED maker Lumileds of San Jose, CA, USA has launched the LUXEON XR-3020, an ultra-slim module that serves as a building block for TLEDs or thin office and industrial fixtures. As the latest addition to the Matrix Platform family of ...

Tags: Lumileds, LUXEON XR-3020

Royal Adhesives & Sealants Acquires Adhesive Systems

Feb 6, 2016

Royal Adhesives & Sealants has acquired the stock of Adhesive Systems. Based in Frankfort, IL, ASI develops, manufactures, and markets cyanoacrylate, methyl methacrylate, epoxy and anaerobic adhesives and sells to the assembly adhesives ...

Tags: Adhesive Systems, Adhesives, Sealants

Nationstar Signs Two Equipment Procurement Contracts Totaling RMB 150M

Dec 15, 2015

Nationstar announced it signed two separate procurement agreements with ASM Microelectronics Technical Services (Shanghai) (ASM Microelectronics) and ASM Pacific (Hong Kong Limited). According to the company statement, the agreement ...

Tags: Nationstar, automated wire bonding machine

Osram Launches Duris S 5 Color LEDs for Color-Mixing Consumer Lighting Applications

Dec 3, 2015

For smart lighting solutions and colored lighting applications, Osram Opto Semiconductors GmbH of Regensburg, Germany has launched Duris S 5 Color LEDs - available in four color versions: Red (620nm), Amber (610nm), Green (545nm) and Deep ...

Tags: Osram, LEDs

Axalta Enhances Nap-Gard Powder Coating Offerings

Dec 3, 2015

Axalta Coating Systems, a leading, global manufacturer of liquid and powder coatings, is pleased to announce the enrichment of its Nap-Gard fusion bonded epoxy (FBE) powder coatings. Through our continuous improvement efforts, Axalta has ...

Tags: Axalta, liquid coatings, powder coatings

Lattice Power CTO: Low and Mid-Power LED Chip Becomes Major Trend in the Industry

Nov 12, 2015

The LED industry is gradually maturing in 2015, with products cost/performance (C/P) ratio becoming increasingly important. Low and mid-power flip chip products are increasingly valued by the industry. To further understand this trend ...

Tags: LED industry, LED chip, Chip Scale Packaging

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