micro electro mechanical systems articles & resources on Made-in-China.com

EVG Earns Fifth Consecutive Triple Win in Vlsiresearch Annual Customer Satisfaction Survey

Jul 5, 2017

For the fifth consecutive year, EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – has earned all ...

Tags: EV Group, Chip Making Equipment

Leti Orders EVG Hercules NILSystem to Bolster Process Development and Demo Capabilities of EVG-Leti Inspire Program

Sep 23, 2016

EV Group of St Florian, Austria - a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS), compound semiconductors, power devices and nanotechnology applications says that a HERCULES ...

Tags: EV Group, NIL, EVG-Leti INSPIRE

Mitsubishi Heavy Industries Machine Tool Collaborating with D-process on Room-Temperature Wafer Bonding Services

Sep 9, 2016

Mitsubishi Heavy Industries Machine Tool Co Ltd of Ritto City, Shiga, Japan (founded in October 2015), a group company of Tokyo-based machinery maker Mitsubishi Heavy Industries Ltd (MHI), has agreed with D-process Inc of Yamato, Kanagawa, ...

Tags: Mitsubishi Heavy Industries, D-process, room-temperature wafer bonding

Buler, Bosch to Expand Collaboration on Innovative Food Processing

Aug 24, 2016

Bühler Group has announced that it will expand the collaboration with German electronics manufacturer Bosch Connected Devices and Solutions for increased innovation and market launches. The Uzwil, Switzerland-based global process ...

Tags: Bühler, Bosch Connected Devices, Innovative Food Processing

Finetech's Lambda Bonder Enhances Packaging Capabilities at Lurie Nanofabrication Facility

Jun 27, 2016

Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is ...

Tags: LED, packaging equipment

X-FAB Offers High-Volume 6-Inch SiC Foundry Production

Mar 15, 2016

X-FAB Silicon Foundries of Erfurt, Germany - a mixed-signal IC, sensor and micro-electro-mechanical systems (MEMS) foundry – has entered wide-bandgap semiconductor production by announcing the availability of silicon carbide (SiC) ...

Tags: SiC MOSFET SiC Schottky barrier diodes SiC power devices

Solvay to Showcase Specialty Polymers at Semicon Taiwan 2015 for Fab Processes

Nov 10, 2015

Solvay Specialty Polymers, a world leader in the research, development and manufacturing of high-performance materials designed to master the most challenging requirements in the semiconductor industry, will showcase at Semicon Taiwan 2015 ...

Tags: Solvay, Specialty Polymers, Semicon Taiwan

Plasma-Therm Acquires Plasma Processing Technology From Nanoplas France

Nov 4, 2015

Plasma process equipment maker Plasma-Therm LLC of St Petersburg, FL, USA has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal. High Density Radical Flux (HDRF) was developed by ...

Tags: Plasma-Therm, plasma technology, HDRF

EVG Has Unveiled The HERCULES NIL

Jul 10, 2015

EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has unveiled the HERCULES NIL — a fully integrated track system that combines cleaning, ...

Tags: lithography equipment, emerging photonic device

SPTS Has Sold Its Thermal Products Business to SPP Technologies Co Ltd

Jul 7, 2015

SPTS Technologies Ltd of Newport, Wales, UK (which is owned by Israeli firm Orbotech) has sold its Thermal Products business to SPP Technologies Co Ltd (SPT), a subsidiary of Sumitomo Precision Products Co Ltd (SPP) that specializes in the ...

Tags: SPTS Thermal processing systems, SPP technologies, semiconductor

X-FAB Has Announced The First Cost-Efficient 180nm SOI Technology

Jul 7, 2015

X-FAB Silicon Foundries AG of Erfurt, Germany - an analog/mixed-signal and micro-electro-mechanical systems (MEMS) foundry - has announced what it claims is the first cost-efficient 180nm silicon-on-insulator (SOI) technology for automotive ...

Tags: X-FAB, SOI, electrical components

SPTS Technologies Has Sold Its Thermal Products Operations

Jul 6, 2015

UK-based SPTS Technologies has sold its Thermal Products operations to Sumitomo Precision Products’ arm SPP Technologies, in a deal worth $28m. SPP is engaged in the production of micro-electro-mechanical systems (MEMS) and ...

Tags: SPTS technologies, thermal products, MEMS, LED

Veeco's Q4 MOVCD Revenue for Full-Year 2014 of $392.9m, up 18% on $331.7m in 2013

Feb 27, 2015

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue for full-year 2014 of $392.9m, up 18% on $331.7m in 2013. Fourth-quarter 2014 revenue was $113.6m, up 22% on $93.3m last ...

Tags: Veeco, MOCVD

Peregrine Semiconductor Corp of San Diego Integrated Circuits Based on SOI

Jan 16, 2015

Peregrine Semiconductor Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has announced the availability of the UltraCMOS PE42020, which is ...

Tags: mechanical relays, micro-electro-mechanical systems, Electrical

Evatec Agrees to Acquire The Advanced Technologies Segment of Oerlikon of Pfffikon

Dec 24, 2014

Evatec Ltd of Flums, Switzerland, which makes thin-film deposition and etch processing equipment for semiconductor, MEMS, optical and optoelectronic applications, has agreed to acquire the Advanced Technologies Segment of Oerlikon of ...

Tags: deposition systems, packaging, Electrical

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