Asahi Glass Co (AGC) has made a $2.1 million investment in Triton Microtechnologies.
Triton is based in Arizona, USA and owns via-fill technology for interposer substrate, to realise next-generation semiconductor packaging products using ultra-thin glass.
By combining its technologies on ultra-thin glass and micro-hole drilling process with Triton Microtechnologies’ via-fill technology, AGC said it would contribute to the acceleration of next-generation semiconductor packaging development using glass.
Source:
http://www.glassinchina.com/news/newsDisplay_20434.html
