Trade Resources Company News Samsung Provides Under The Name LC013/26/40b New Chip-on-Board (COB) LED Packages Before

Samsung Provides Under The Name LC013/26/40b New Chip-on-Board (COB) LED Packages Before

Tags: LED Package, LED

Samsung Electronics provides under the name LC013/26/40B new chip-on-board (COB) LED packages before. The new LEDs provide a high light yield of 129lm / W and have a compact light-emitting surface (Light Emitting Surface: LES). The new LEDs are suitable for Powerful lighting for indoor and outdoor use as well as for applications with directed light (spot light).

"We are proud to present today our COB package with family Performance of 13, 26 and 40W and a luminous efficiency of 129lm / W.

The LEDs are based on our first-class chip and Phosphor technology, "says Jaap Schlejen, senior vice president, led Lighting Sales and Marketing, Samsung Electronics."The new COB family was developed according to the Zhaga specifications and has a low thermal resistance and an associated excellent heat dissipation, resulting in a higher efficiency and a  high reliability can be achieved.

The LC026B achieved a luminous efficiency of 129lm / W at a  minimum of 80 CRI (color rendering index) and 5000K CCT  (Correlated Color Temperature) and The LC026B reached a  Luminous efficiency of 129lm / W at a minimum of 80 CRI (Color Rendering index) and 5000K CCT (Correlated Color Temperature) and is  Available in versions 2700K, 3000K and 4000K. By using chip-on-board technology and the metal core printed circuit boards circular arrangement of LED chips, the new COB family a  outstanding uniformity of color and light quality. Is also a  high luminous flux of up to 6.000lm in a single LED package  achieved.

Samsung COB family will be available from May. Other additions become a COB package offered by the company at a later 

Added time of the year to customers even more options to offer.

The COB family will be featured on the LIGHT FAIR 2013 International be (stand number 2645). The company also is other LED packages and new LEDs, Lamps and Tubes-L present. The International Light Fair will take place from 23 to 25 April 2013 in Pennsylvania Convention Center in Philadelphia instead.

Source: http://www.ledinside.com/news/2013/4/samsung_chip_on_board_led_package_20130423
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Samsung Introduces New Chip-on-Board LED Packages with High Light Yield Ago
Topics: Lighting