Sequans Communications says its first LTE-Advanced chip will be sampling next quarter.
Supporting 3GPP Release 10 specifications, the Cassiopeia chipset implements carrier aggregation of 40MHz total bandwidth.
“The key feature is extremely flexible carrier aggregation, allowing combination of any two carriers of any size up to 20 MHz each, contiguous or non-contiguous, inter-band or intra-band, for an overall total of 40 MHz of bandwidth," said Georges Karam, Sequans CEO.
"This carrier aggregation gives operators the ability to get the most value possible from their LTE spectrum—even the smallest slices,” said Karam.MIMO
Other features of 3GPP Release 10 include MIMO schemes, enhanced inter-cell interference coordination (eICIC) schemes for heterogeneous networks (HetNet), and improvements to eMBMS (evolved multimedia broadcast multicast service) or LTE Broadcast.
It supports both FDD and TDD duplexing methods. The SQN3220 baseband chip is built in 40nm CMOS.
The SQN3220 Cassiopeia platform includes baseband and RF chips and reference designs.
