In booth 3745 at Super Computing 2012 (SC12) in Salt Lake City (12-15 November), high-speed fiber-optic interconnect firm Molex Inc of Lisle, IL, USA is conducting product demonstrations to showcase its expertise in high-speed, high-density and high-signal integrity interconnect technology.
Molex is displaying the following high-speed interconnect products and solutions:
25Gbps QSFP+ silicon-photonics-based AOCs: Molex recently demonstrated a 100Gbps QSFP+ active optical cable (AOC) based on silicon photonics single-chip transceiver technology enabling next-generation 100Gbps optical interconnect applications. Quad small-form-factor pluggable (QSFP+) 40Gbps QDR and 56Gbps AOC assemblies: Providing what is claimed to be the longest link distance and lowest power consumption on the market, the assemblies achieve 40 and 56Gbps data rates over long reaches of up to 4km (2.49 miles) using only 0.78 and 1W per cable end, respectively. zQSFP+ interconnect solution: Designed for next-generation high-density applications found in high-performance computing, telecoms, data networking, test & measurement, and medical diagnostic equipment. iPass+ (HSC) CXP copper and optical systems: Enables 12 channels of 10Gbps data for up to 120Gbps of total bandwidth; with the enhanced-footprint integrated connectors enabling ten channels of 10Gbps data, for up to 100Gbps of total bandwidth. zSFP+ connector solutions: Supports 25Gbps applications, with backward compatibility for 10Gbps Ethernet and 16Gbps Fibre Channel applications.
At SC12, Molex is demonstrating zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method, says the firm. Data is generated that will support the design of NEBS-rated applications with current- and next-generation pluggable I/O modules.
