VI Systems GmbH of Berlin,Germany(a fabless spin-off of the Technical University of Berlin and the A.F.Ioffe Physico-Technical Institute in St Petersburg,Russia that provides laser and photo-detector chips and modules)has launched a new product line of high-speed VCSEL chips that operate with data rates of up to 40Gb/s.
The new generation of high-speed 850nm VCSELs and 1x4 and 1x12 VCSEL arrays feature an ultra-high-3dB modulation bandwidth of 20GHz.They also have a novel HAB contact pad design which overcomes the problems of thick and soft planarization layers(characteristic to high-speed VCSEL designs)and which enables ultra-robust bonding and packaging.
VI Systems says that its novel manufacturing approach and array designs are in compliance with the standard 250μm device-to-device pitch(linear spacing),allowing systems developers to dramatically extend their capabilities in energy-efficient data communication.Die-level samples are available now.
