Mereco Technologies has announced that METADUCT 1202 Silver Adhesive is compliant with NASA's outgassing specification.
The silver-filled, electrically conductive epoxy is designed for lead attachment cold soldering, chip bonding, and lead frame bonding applications.
Supplied in plastic bubble packs from 2gm to 200 gm, five kits from 2 to 32 oz., and pre-mixed and frozen syringes, the silver adhesive cures at room temperature, the company said.
Solvent-free, non-bleeding, and thixotropic silver adhesive has a volume resistivity at 25°C of 10(^-4) Ohm-cm, 800 psi lap shear strength, and exhibits 80D Shore hardness.
The applications of the product include manufacturing, assembly, and repair of heat-sensitive components.
Source:
http://packaging.pharmaceutical-business-review.com/news/mereco-metaduct-1202-silver-adhesive-meets-packaging-requirements-040412
