This means that handsets of the future will be able to offer improved processor clock speeds and better battery life thanks to the new cooling system.
It’s currently very difficult to keep smartphones cool, particularly as components are becoming progressively more powerful.
That’s because unlike computers, portable devices can’t accommodate blower fans or water-cooling pumps.
Fujitsu, however, wants to install a thin loop heat pipe onto components to reduce heat.
This pipe will be a closed loop carrying a liquid coolant. The warmth from the heat source evaporates the coolant, with the energy used to cause the evaporation transported away from the component.
It’s much the same as sprinkling water on a pavement to reduce heat on hot summer days.
The current approach to cooling smartphones is to install sheets of metal or graphite that are really good at absorbing heat.
These sheets then transfer heat away from heat-generating components like your phone’s processor, which helps avoid hotspots.
