U.S. scientists have developed a new technology recently,it is expected to greatly enhance the cooling effect of computer and microelectronics equipment.Scientists have been apply patent for this refrigeration equipment which can cooling the electronic chip.They hope it make commercial production as soon as possible.
Air bearing heat exchanger was develpoed by U.S. Department of Energy's Sandia National Laboratories.The latest Air bearing heat exchanger will reduce the energy consumption greatly of cooling data centers and large-scale computing environments processor chips.In the U.S.,the electricity bills of information technology centers have billions of dollars every year and still continues to grow.
In a traditional CPU cooling equipment,the cooling bottleneck is boundary layer which attached to the heat sink thermal stagnation zone.If use air bearing heat exchanger,the heat through a narrow air gap and pass from a fixed platform to a rotating device effectively.Stagnant boundary layer coverd heat sink will be subjected to a centrifugal effect,that will greatly enhance the cooling effect
