Compact Osram LED for automotive headlights now with two chips for greater brightness
The Oslon Black Flat is now also available on the market as a 2-chip variant. As with other LEDs from the Oslon Black family, the new version also features a high level of brightness and is suitable for all headlight functions. The major advantage of the new LED: As an SMT component it can be attached directly to the PCB and can then be processed further with other components as part of a standard soldering process. The simplicity of this implementation translates into large cost and time savings during further processing.
Thanks to UX:3 chip technology, the new Oslon Black Flat features a very high light output even with high currents, achieving over 500 lumens at 1 ampere. The high brightness level of the new LED is emitted from a very compact package with dimensions of merely 3.1 mm x 3.75 mm and a height of 0.5 mm. "With the new Oslon Black Flat we're bringing a significantly more slender LED than the previous version into our portfolio to enable even more compact headlight systems," explained Florian Rommen, LED Automotive Marketing at Osram Opto Semiconductors. The 2-chip LED is suitable for all headlight functions, primarily for daylight running light with light guides, as well as generally for low beam and high beam light.
Cost savings with Surface Mount Technology (SMT)
As a surface mountable component, the new Oslon Black Flat can be, akin to other electronic components, attached simply to a circuit board and processed further as part of standard soldering. "This soldering capability enables processing the LED in a simple, standardized process and reduces the complexity of the processing steps, which saves a good deal of time and costs," continued Rommen.
Oslon Black Flat – good stability and homogeneous light distribution
Further benefits of the Oslon Black Flat are their homogeneous distribution of light, very good contrast ratio and cyclic stability.
The black QFN (Quad Flat No Leads) housing expands in a similar manner to the circuit board during high temperature cycle loads. As a result, soldered joints are considerably stronger and exposed to much less strain.
A special sealing technology together with the sophisticated package and ceramic converter enable the highly uniform distribution of light as well as good contrast conditions on roads: Chip encapsulation is directly in the package to achieve a defined bright/dark border in the light beam, and the high contrast of the luminous surface of both chips in relation to the package also contributes to this.
Samples of the Oslon Black Flat are available now, and volume start-up is planned for the turn of the year. See the product catalog for further information about the Osram Oslon Black Flat range.
Product catalog: Osram Oslon Black Flat range Oslon Black Flat (KW H2L531) technical data: Footprint 3.1 mm x 3.75 mm x 0.5 mm Brightness > 500 lm at 1A Typical electrical thermal resistance 1.2 K/W Chip technology UX:3, Rth improved Chip-to-chip distance 100 μm (0.1 mm) Further information QFN multichip LED
