IPC – Association Connecting Electronics Industries released a global survey this month to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC’s 2014 Technology Trends Study. Participation is open to all manufacturers of printed circuit boards and board assemblies worldwide. The deadline for survey responses is January 31.
The survey covers key technical issues in both fabrication and assembly of PCBs, including clock speed, heat dissipation, layer counts, embedding, aspect ratios, I/O pitch and component size. Respondents may answer the questions that relate to their type of operations, focusing on specific end-use applications.
Survey participants will receive the 2014 Technology Trends Study at no charge and before it becomes available for sale. In addition, the first 100 people to submit a valid and usable survey will receive a free copy of the 2015 IPC International Technology Roadmap for Electronic Interconnections. The study and Roadmap are published every two years.
