Global adhesives manufacturer, Henkel is set to introduce its latest adhesive developments for packaging at the Efficient Consumer Response (ECR) Europe Conference & Marketplace taking place on 14 and 15 May in Brussels.
The company's latest development for packaging includes the hotmelt Technomelt Supra 1000, which offers improved applicability and reduced consumption.
Henkel will also present the Adhesin Low Migration range of waterbased packaging adhesives which have been managed to formulate without plasticizer.
This year, the company is focusing on food safety in particular, with the emphasis on promoting an exchange of views, and expanding collaboration with all its partners along the value chain.
Source:
http://packagingservices.packaging-business-review.com/news/henkel-to-introduce-new-adhesive-developments-for-packaging-300413
