RF front-end component maker and foundry services provider TriQuint Semiconductor Inc of Hillsboro, OR, USA has introduced a new high-performance duplexer bank. The new filter module serves two of the world’s most challenging RF bands for smartphones and other mobile devices, says the firm.
TriQuint’s bulk acoustic wave (BAW) and temperature-compensated surface acoustic wave (TC-SAW) technologies enable simultaneous voice and data for next-generation 3G/4G smartphones, particularly in RF bands with the most demanding performance requirements. TriQuint’s new TQQ2526 duplexer bank leverages both technologies, utilizing BAW to support Band 25 and TC-SAW to serve Band 26 in the North American market. The module integrates two duplexers into a single, compact package that provides extended frequency range and requires less board space.
The TQQ2526 duplexer bank provides outstanding filter performance, with high isolation over the full bandwidth and very low variation over temperate ranges. The highly integrated, ultra-small 2.8mm x 4.7mm x 1mm module features a single antenna connection, eliminating the need for antenna switching. Its low transmit insertion loss reduces total current consumption, extending battery life and usage time. The TQQ2526 enhances receiver sensitivity and dynamic range with low Rx insertion loss and high rejection of Tx signals at the Rx ports.
TQQ2526 is sampling now and scheduled for mass production by June. Visit TriQuint in Booth 6E-84 at the 2013 Mobile World Congress in Barcelona on 25-28 February for more information about the firm’s advanced filter solutions.
