Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017.
The new Truebump technology delivers quick, accurate and repeatable 3D metrology for packaging bumping applications such as copper pillar, microbumps and large C4 bumps.
On a single platform, the firm will integrate high-volume 2D inspection and 3D bump metrology by using the Dragonfly inspection system.
The first Dragonfly inspection system equipped with the Truebump technology has been exported to a US-based IC manufacturer.
Compared to the previous generation tool of Rudolph, the new technology will be three times faster and 25 percent more repeatable.
Integrating the high volume output of the inspection system with the accuracy and repeatability will increase the usage of stacked devices in packaging applications.
Rudolph Technologies senior director of inspection product management Matt Wilson said: “Truebump Technology combines multiple 3D metrology techniques to provide faster, more accurate, and more repeatable measurements of the 3D features that are critical in advanced packaging technologies.
“As 2D and 3D dimensions decrease, the tolerances for manufacturing become tighter, and device stacking continues to drive an increase in functionality. Because these 3D connections are so vital for reliability, the bump height measurements need to be absolutely accurate.
“A single wafer may contain 50 million bumps, each with multiple data points, creating massive amounts of data. The Dragonfly system’s integrated connection with Discover analytics software gives users tools to visualize data, correct coplanarity variations, and improve yields.”
Headquartered in the US, Rudolph Technologies specializes in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software. Founded in 1940, the company employs over 1000 people.
