Qualcomm, Samsung Electronics, MediaTek, Apple and Spreadtrum Communications are gearing up to roll out their 10nm mobile chips which will be shipped in smartphones during 2017.
Qualcomm recently announced its 10nm mobile chips will be built by Samsung's foundry business. Qualcomm's Snapdragon 835 is in production now and expected to ship in commercial devices in the first half of 2017, the company said.
Samsung's next-generation Exynos series will also be built in-house using 10nm process technology. Mass production of Samsung's 10nm Exynos mobile chips is expected to kick off in the first half of 2017, according to industry sources.
MediaTek will reportedly roll out two 10nm mobile chips - the Helio X30 and X35 - manufactured using TSMC's 10nm FinFET process. MediaTek is among TSMC's first group of customers adopting 10nm process technology.
MediaTek is expected to enter volume production for the Helio X30-series SoCs between the end of 2016 and early-2017, and the X35 series will be built using a lower-spec variant of the foundry's 10nm processes, according to previous reports.
TSMC will also be engaged in the manufacture of 10nm chips for HiSilicon, which will power Huawei's flagship smartphone series for 2017, industry sources believe.
