UK-based etch and deposition system maker Oxford Instruments has been chosen by Sweden's Chalmers University of Technology to supply a FlexAL ALD (atomic layer deposition) system for installation in its cleanroom. FlexAL systems provide a range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote-plasma ALD processes and thermal ALD within a single ALD system, says Oxford Instruments.
ALD allows ultra-thin films of a few nanometres to be deposited in a precisely controlled way. Its two defining characteristics - self-limiting atomic layer-by-layer growth and highly conformal coating - offer benefits in semiconductor engineering, MEMS and other nanotechnology applications. The firm adds that its FlexAL system delivers maximum flexibility in the choice of materials and precursors, i.e. low-temperature processes enabled by plasma ALD; low damage maintained by the use of remote plasma; and controllable, repeatable processes via recipe-driven software interface.
"We have seen an increased need for very thin, high-quality films of precise thickness in our nanotechnology research," says Dr Mats Hagberg, process equipment specialist at Chalmers' Nanofabrication Laboratory. "Introducing atomic layer deposition capability to our process laboratory will make it possible for us to take our terahertz, microwave, and quantum components research to a new level. FlexAL was the ALD system on the market that best matched our technical specification," he adds.
"The FlexAL ALD tool offers the ideal platform for research and development into many new application areas, and has the flexibility to process various materials and handle a wide range of substrates," claims Oxford Instruments' ALD product manager Chris Hodson.
