HRL Laboratories LLC in the USA has developed a gallium nitride (GaN) vertical tunneling Schottky barrier diode (TBS) that gives good combined on and off performance, compared with vertical Schottky barrier diodes (SBDs) [Y. Cao et al, ...
Unilever is rolling out 17 new frozen treats in 2016 across five of its ice cream brands – Breyers, Good Humor, Klondike, MAGNUM Ice Cream and Popsicle. Each brand is scooping out a delicious assortment of popular flavors and ...
Tags: Unilever, Frozen Treats, Breyers, Good Humor, Klondike, MAGNUM, Cream
LED epitaxial wafer and chip maker Genesis Photonics has developed LED chips for Taiwan- and China-based makers to produce automotive Bi-bea Month Volume(Units) Value(USD) Year-on-Year ...
Tags: Test
CVD Equipment Corp of Central Islip, NY, USA (a designer and maker of chemical vapor deposition, gas control, and other equipment for developing and manufacturing materials and coatings) has announced the next phase in its industrial ...
POET Technologies Inc of San Jose, CA, USA — which has developed the proprietary planar optoelectronic technology (POET) platform for monolithic fabrication of integrated III-V-based electronic and optical devices on a single ...
WIN Semiconductors Corp of Tao Yuan City, Taiwan – the largest pure-play provider of compound semiconductor wafer foundry services – has announced its entry into the high-data-rate optical device market by adding optical device ...
Tags: WIN Semiconductors, InP
Nanoelec Research Technological Institute (IRT) in Grenoble, France - an R&D consortium headed by CEA-Leti focused on information and communication technologies (ICT) using micro- and nanoelectronics - has announced the first co-integration ...
Tags: III-Vs-on-Si, Direct wafer bonding
Kulicke & Soffa Industries has launched new FCC Hub Blades, extending the successful AccuPlus series. The new FCC Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved ...
Mercedes-Benz Style has joined hands with Italian light design company Artemide and the two companies will showcase their latest product at the “Light + Building” trade fair in Frankfurt. It embodies the Mercedes-Benz design ...
Tags: VMercedes-Benz, Artemide, Frankfurt, Light, Building
Cadence Design Systems is offering complete IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs. Designed to accelerate the multi-chip integration for ...
Tags: Cadence Design system, IC, Packaging
X-FAB Silicon Foundries of Erfurt, Germany - a mixed-signal IC, sensor and micro-electro-mechanical systems (MEMS) foundry – has entered wide-bandgap semiconductor production by announcing the availability of silicon carbide (SiC) ...
Tags: SiC MOSFET SiC Schottky barrier diodes SiC power devices
Researchers in the UK have claimed the first demonstration of laser diodes grown directly on silicon that perform up to 75°C and 120°C under continuous wave (cw) and pulsed operation, respectively [Siming Chen et al, Nature ...
Tags: Quantum dot lasers, GaAs, Silicon substrate, MBE
Samsung Electronics Co Ltd of Seoul, South Korea has introduced a full line-up of chip-scale LED packages (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung says that its CSP ...
EnergyTrend, a division of TrendForce, reports that the global PV market is seeing slowing demand after the Chinese New Year holidays. Peak installation seasons in the U.S. and Japan have passed, and the demand related to China’s ...
At the SEMI Industry Strategy Symposium Europe 2016 conference in Nice, France (6–8 March), Paul Lindner, executive technology director at EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for ...
Tags: EV Group, Engineered substrates