Mondi said it will show how its packaging solutions are addressing industry and consumer trends at the 2017 Pack Expo trade fair, which is due to be held from September 25 to 27, 2017 at the Las Vegas Convention Center in the US. At the ...
ROHM Semiconductor of Kyoto, Japan has launched what it claims is the industry’s smallest class (1608 size) of two-color chip LEDs. The SML-D22MUW also features a special design that is said to improve reliability along with a ...
Wolfspeed of Raleigh, NC, USA — a Cree Company that makes silicon carbide (SiC) power products and GaN-on-SiC high-electron-mobility transistors (HEMTs) and monolithic microwave integrated circuits (MMICs) — has extended its ...
Tags: Wolfspeed, silicon carbide
Tokyo-based Showa Denko K.K. (SDK) has expanded its product lineup of infrared light-emitting diode (IR-LED) chips, which are mainly used as parts of photo-couplers for gate drivers in power semiconductor modules and parts of sensors for ...
Flexible packaging firm ProAmpac, part of the Pritzker Group Private Capital portfolio of companies, has completed the acquisition of Clondalkin Flexible Packaging Orlando from Holland’s Clondalkin Group. The companies did not ...
Tags: Flexible Packaging, Packaging
Microsemi Corp of Aliso Viejo, CA, USA (which makes chips for aerospace & defense, communications, data-center and industrial markets) has become a member of PowerAmerica — a manufacturing institute consisting of public and private ...
MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...
Tags: Die Bonder, Photonics
API is set to introduce new TA+ cold foil at this year’s LabelExpo Europe event in Brussels, Belgium. The event will take place from 25 to 28 September. The company has developed new cold foil for pack designers and printers to ...
US-based packaging and bottling line systems manufacturer Krones is investing in a new training and technology center in southeastern Wisconsin, US. The 40,000ft² facility, which will serve the company’s customers and ...
Tags: Krones, packaging, bottling line systems
Trelleborg Sealing Solutions is showcasing its new sealing solutions for beverage and liquid food industries at the upcoming Drinktec 2017, to be held in September. At the expo, which will be held in Munich, Germany, the company will ...
Tags: Trelleborg, beverage
Mark Andy Digital One, a CMYK dry-toner device with inline decorating and converting, has received the BS5609 certification on Avery Dennison substrate. BS5609 is a certification that guarantees label durability in harsh marine and ...
UPM Raflatac has provided its new Raflex MDO film labels to the Clemson University in South Carolina, US. The university has used new Raflex MDO film labels in its Phoenix Challenge Foundation competition, which promotes the flexographic ...
Oxford Instruments plc plans to increase personnel at its R&D base at Taiwan’s Industrial Technology Research Institute (ITRI), and to leverage ITRI's R&D capacities to strengthen their cooperative relationship in technology ...
Tags: Oxford Instruments
Valmet has completed the annual shutdown of Klabin Monte Alegre paper mill in Brazil. The company wrapped up the entire shutdown project from planning and execution to a safe start-up. The shutdown was happened between 24 April and 5 ...
Tags: Valmet, Paper Mill
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA, which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications, has announced the availability of a ...