US-based TEL NEXX, a wholly owned subsidiary of Tokyo Electron US Holdings, has announced that it entered into a pact with IBM for a new multi-year joint development program in 3D semiconductor packaging. According to TEL Nexx, as 3D ...
Tags: TEL NEXX, IBM, 3D semiconductor packaging
US-based semiconductor packaging and test services provider Amkor Technology announced that its latest flip chip molded ball grid array (FCmBGA) packaging technology will be used by Altera Corporation in its 28-nm Arria V field programmable ...
Using proprietary Nano-Pore Silicon Substrate(NPSS)technology developed by Daewon Innost,Glaxum arrays provide the industry's best thermal dissipation performance with unprecedented thermal impedance of only 0.41 degrees centigrade per ...
Daewon Innost has made a breakthrough on its Glaxum LED array family of chip on board (COB) modules, which it claims to achieve the LED industry's best thermal dissipation performance. The proprietary Nano-Pore Silicon Substrate (NPSS) ...
Tags: LED, Daewon, performance.