In its newsletters in April 2016 and June 2015 in-situ metrology system maker LayTec AG of Berlin, Germany reported on x-ray diffraction (XRD)-gauged nk database improvements for InGaAsP (indium gallium arsenide phosphide) and InGaAlAs ...
The Adidas Group officially laid the foundation stone for two new employee buildings at its headquarters in Herzogenaurach. 'Campus Expansion South is a further key prerequisite for the company's continuing growth and includes a new ...
Raytheon UK's Integrated Power Solutions (IPS) business unit in Glenrothes, Scotland, has developed a high-temperature, small-form-factor bridge leg power module. Aimed at high-speed switching applications, the module has potential uses in ...
Tags: Raytheon, Electrical Switching
India based packaging firm Uflex has expanded its partnership with WaveFront Technology to manufacture Fresnel lens packaging films in Europe. The partners plan to commence film manufacturing in the final quarter of 2016. The ...
Tags: Uflex, Lens Packaging
Volvo Cars is the next automaker to join The Automotive Information Sharing and Analysis Center (Auto-ISAC) as the latest original equipment manufacturer member. Volvo Cars Group chief information officer and senior vice president Klas ...
Tags: Volvo Cars, Auto-ISAC
Toyoda Gosei Co Ltd of Kiyosu, Aichi Prefecture, Japan has developed what is claimed to be the first 1.2kV-class power semiconductor device chip capable of large-current operation exceeding 20A. Picture: Forward current–voltage ...
With the re-grouping of teams from III-V Lab (the joint Alcatel-Lucent, Thales and CEA-Leti industrial research laboratory), Almae Technologies SAS is taking over III-V Lab's facilities at Marcoussis, which is sited on the Plateau de Saclay ...
Tags: CEA-Leti, III-V Lab, laser components
At its annual Imec Technology Forum (ITF) USA on 11 July, a half-day conference at the San Francisco Marriott Marquis hotel held in conjunction with the SEMICON West trade show and supported by industry association Semiconductor Equipment ...
Tags: IMEC, GaN-on-Si, III-Vs-on-silicon
Japanese printing company Dai Nippon Printing has signed an agreement with SIG Combibloc, a manufacturer of cartons for food and beverages, to collaborate in the food and beverage carton business in Japan. The collaboration will leverage ...
Tags: Dai Nippon Printing, beverage carton business, SIG Combibloc
LeddarTech unveiled key insights about its LeddarCore IC roadmap, which can enable low-cost, high-performance solid-state LiDARs for multiple automotive safety applications—from ADAS to autonomous driving. During the Sensors EXPO ...
Tags: Autonomous Driving, LeddarCore ICs
Germany based Knorr-Bremse has signed a deal with Bosch to acquire its on-highway CVS transmission components business in Japan. Following the acquisition, Knorr-Bremse will develop and manufacture gear shift units and clutch actuators as ...
Tags: Commercial Vehicle, Bosch
BMW, Intel and Mobileye have joined forces for the development of autonomous cars with an intention to put them on the road by 2021. Through their collaboration, the companies plan to develop future-proofed solutions that allow the ...
Tags: Self-Driving Cars, BMW
The system of toy blocks encourages kids to make connections in order to control other toys, such as make a robot draw lines on paper, through the basics of coding. Google has joined the latest swathe of firms making headway in the fight ...
US-based ConAgra Foods Lamb Weston and its Netherlands-based partner Meijer Frozen Food have announced to form a new joint venture to cater to the Russian market. The establishment of the joint venture is subject to approval from Federal ...
Tags: joint venture, FAS, ConAgra Foods
International technology company Continental is partnering with the US Department of Transportation (U.S. DOT)'s Smart City Challenge. Continental has initially pledged at least $1m to the winning city to provide improved safety and ...
Tags: V2X, The Smart City