Dana has broke ground on a new 7,500m2 production and assembly facility in Chongqing, China, that will manufacture advanced driveline products for the Chinese market. Scheduled to open in late 2018, the facility will produce final drive ...
Tags: Dana, driveline products
Luxembourg-registered synthetic diamond materials firm Element Six (E6), a member of the De Beers Group of Companies, has developed a new thermal grade of synthetic diamond grown by chemical vapor deposition (CVD). Diafilm ETC700 is both ...
Siemens business unit Mentor has introduced a new solution for the design and verification of the existing IC package designs. The Mentor Xpedition High-Density Advanced Packaging (HDAP) flow solution can be used for rapid prototyping ...
Tags: Siemens, Packaging Flow
Fisher Container Holdings has acquired US-based flexographic printing and converting solutions provider Packaging Products Corporation (PPC). Based in Mission of Kansas, PPC is involved in flexographic printing and converting of flexible ...
Tags: Packaging Products, Container
Amcor is showcasing its new packaging solutions at the International Deli Dairy and Bakery Association’s (IDDBA 17) annual trade show in Anaheim, California, US. The event is being held between 4 and 6 June at the Anaheim Convention ...
Technology firm Continental has partnered with Chinese search-engine giant Baidu to work in the areas of automated driving, connected vehicles and intelligent mobility services. The two companies have signed a strategic cooperation ...
Tags: Connected Vehicles, Continental
German automaker Daimler and its Chinese partner BAIC Group have signed a new framework agreement for the production of electric vehicles. The agreement is focused on two significant investments. The first part is that Daimler will invest ...
Tags: Daimler, Electric Vehicles
Qualcomm has announced its latest charging standard - QuickCharge 4+. The successor to Quick Charge 4 brings a number of discernible benefits to future handsets running the firm’s Snapdragon 835 chipsets. When the firm announced ...
Tags: Qualcomm, Quick Charge 4
Mondi is set to showcase a range of advanced packaging solutions at the RosUpack 2017 event in Russia. The event will take place from 20 to 23 June in Moscow. At the event, the firm will exhibit various packaging solutions, including ...
Tags: Mondi, Packaging Solutions
Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has launched what it claims is the first gallium nitride on silicon carbide (GaN-on-SiC) front-end ...
Tags: silicon carbide
Wide-format printers provider Roland DGA has unveiled a new software for its Texart Dye-Sublimation inkjet printers. The ErgoSoft Roland Edition 2 RIP software has been developed by ErgoSoft exclusively for Roland’s Texart RT-640 ...
Valmet will deliver a moisturiser system for Schumacher Poledno’s corrugated line in Bukowiec, Poland. The company will supply its IQ Moisturiser with two beams that will allow the mill to enhance corrugated board quality and to ...
Plastic processing equipment maker Milacron has exhibited its advanced injection molding machine portfolio at Chinaplas 2017 event in Guangzhou, China. At the event, the company exhibited Ferromatik 160 Series machines, which provides ...
Rotoflex has expanded its presence in Canada, through shifting its manufacturings operations to the facility near Toronto. Following the 2016 move of Rotoflex’s Canadian regional office to a larger, new 18,000 square ft. showroom ...
In booth 1H2-01 at the CommunicAsia 2017 event in Singapore (23-25 May), Advantech Wireless Inc of Montreal, Canada (which manufactures satellite, RF equipment and microwave broadband communications systems) has launched the SSPB-3010Ka ...
Tags: Advantech Wireless, upconverter