SAKATA INX and its subsidiary INX International Ink are exhibiting narrow web label, sleeve and flexible packaging ink products, UV, EB and low migration inks and coatings and digital printing technologies, at Labelexpo Europe to be held in ...
The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has completed the initial hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed, high-density ...
Tags: pluggable interface, hardware
MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is showcasing its portfolio of optoelectronics and photonic ...
Tags: semiconductors, components
NeoPhotonics Corp of San Jose, CA, USA (a vertically integrated designer and manufacturer of hybrid photonic integrated optoelectronic modules and subsystems for high-speed communications networks in telecom and data-center applications) ...
UK-based packaging and labelling equipment supplier Advanced Dynamics has relaunched its upgraded, precision filling systems. The updated systems, which can be used by the pharmaceutical, food, beverages, cosmetics, detergents and ...
The Label Makers, known as Labmak, has invested in Durst’s new eight-colour Tau 330 RSC label press, in a bid to enhance its production operations. Durs said The Label Makers is the first UK beta site customer for the new digital ...
Pro Mach’s subsidiary Edson is set to introduce new robotic mixed-product case packing solution at the Pack Expo in Las Vegas, US. The solution is cliamed to offer the speed and flexibility needed for e-commerce fulfillment and food ...
Tags: food packing, tray packer
Bosch has revealed what it describes as a start-up powertrain for electric vehicles. It’s now common knowledge that a more powerful battery will increase an electric car’s range. But can a new powertrain have a comparable ...
Tags: electric vehicles, powertrain
Toyo Ink Group is set to exhibit its latest label and packaging solutions at this year’s Labelexpo Europe event in Belgium. Toyo Ink Group’s members Toyo Ink Europe and Toyo Ink Co will exhibit their latest developments for ...
Tags: Labelexpo Europe 2017, Toyo, Packaging
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has won a ...
PowerAmerica — a manufacturing institute consisting of public and private partners from the semiconductor industry, the US Department of Energy (DoE), national laboratories and academia — in early August selected Navitas ...
Tags: PowerAmerica, Fast Chargers
X-Rite, along with its subsidiary Pantone, and Rutherford Graphic Products will exhibit color management solutions at the Print17 event in the US. The event will take place from 10 to 14 September 2017 in Chicago. At the event, X-Rite ...
Tags: Graphic Products, Print17
The US Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E) has announced $30m in funding for 21 projects as part of the CIRCUITS program (‘Creating Innovative and Reliable Circuits Using Inventive Topologies ...
Tags: WBG devices, electronics devices
Tokyo-based Showa Denko K.K. (SDK) has expanded its product lineup of infrared light-emitting diode (IR-LED) chips, which are mainly used as parts of photo-couplers for gate drivers in power semiconductor modules and parts of sensors for ...
MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...
Tags: Die Bonder, Photonics