Bosch Packaging Technology has launched AFG 5000, a latest addition to its AFG series of filling and closing machines. The company will be showcasing the AFG 5000 in Crailsheim from September 18 through 29, 2017. The AFG 5000 filling ...
Tags: Bosch, Closing Machine
PAC Machinery said that it has exceeded its goals for introducing new packaging equipment at the Pack Expo / PHARMA EXPO exhibit and symposium in Las Vegas, Nevada, US. Described as the year's most comprehensive packaging event, PACK EXPO ...
Tags: PAC Machinery, Packaging
As part of its continuing actions to improve profitability and cash flow, NeoPhotonics Corp of San Jose, CA, USA (a vertically integrated designer and manufacturer of hybrid photonic integrated optoelectronic modules and subsystems for ...
Tags: NeoPhotonics
Following development that was partially supported by Japan’s New Energy and Industrial Technology Development Organization (NEDO), Tokyo-based Mitsubishi Electric Corp is to launch the MGFG5H3001, a Ka-band (26–40GHz) 8W ...
Tags: Power Transmitters, Mitsubishi
LED chip, lamp and lighting fixture maker Cree Inc of Durham, NC, USA has launched a family of XLamp CMA high-current LED arrays that provide what is claimed to be the best lumen density and efficacy for metal-based chip-on-board (COB) ...
Tags: LED arrays, LEDs
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA - which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications - has announced the availability of two ...
Tags: EPC, Wireless Power Demonstration
Market insiders noted that TSMC (Taiwan Semiconductor Manufacturing Co.), the world's largest semiconductor foundry headquartered in Taiwan, will see a strong revenue performance as the firm won massive orders from multinational ...
Tags: TSMC, semiconductor
Denmark-based folded cartons producer Emballage Gruppen has invested in Domino’s seven-color N610i UV ink jet hybrid solution, in a bid to improve production operations. The seven-color system features Domino N610i integration ...
Tags: folded cartons, UV ink jet
Fujifilm is all set to unveil Inca SpyderX, a UV wide format press, and other advanced inkjet innovations at the upcoming SGIA Expo 2017 to be held in New Orleans, Louisiana. FUJIFILM North America Corporation, Graphic Systems Division ...
Tags: Fujifilm, SGIA Expo 2017
Canada-based Nova Chemicals has introduced three new sealant resins for flexible packaging applications. The new resins, including VPsK914, SPsK919 and SPs116, can be used in applications such as hot fill and institutional packaging. ...
Tags: Nova Chemical, Flexible Packaging
The M1 and M5X inline flexo presses demonstrated on the BOBST stand at Labelexpo Europe 2017, are the latest configurations of the existing presses that have been best sellers in their respective markets. The best Total Cost of Ownership ...
Tags: BOBST, Labelexpo Europe 2017
Source Photonics Inc of West Hills, CA, USA (which provides broadband access optical components and modules) and the Jintan Economic Development Zone have announced the establishment of a new optical laser production plant in Jintan, China. ...
Tags: MOCVD, Source Photonics
Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA (which makes high-power semiconductor laser components) has announced the commercial availability of its actively cooled laser bars, emitting 200W of ...
ITT Enidine will demonstrate a range of custom motion control solutions for the packaging industry at Pack Expo to be held in Las Vegas from September 25 to 27, 2017. The Enidine’s products have been designed for demanding packaging ...
Tags: ITT Enidine, Pack Expo, packaging
To keep pace with the dramatic size and weight reductions in laptop designs over the last 10 years, Navitas Semiconductor Inc of El Segundo, CA, USA has launched what it claims is the smallest 65W USB-PD (Type C) adapter reference design. ...
Tags: GaN Power, Laptop Adapter