Samsung Electronics America, a subsidiary of Samsung Electronics, has announced the US launch of UGEO H60 ultrasound system. Integrating SDMR image processing technology that provides sharp 2D images for optimal diagnostic performance, ...
Tags: Samsung, UGEO H60, Ultrasound System
In booth 1617 at the IEEE MTT-S International Wireless Symposium (IWS2013) in Beijing, China (16-18 April), AWR Corp of El Segundo, CA, USA, which supplies electronic design automation (EDA) software for designing RF and high-frequency ...
Tags: electronic design automation, AWR
Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED ...
Tags: Veeco, Instruments, silicon wafer substrates
When some of Iraq's most historic sites were destroyed by war, Ben Kacyra decided to sell his civil engineering company and start a nonprofit in 2003 with the mission of digitally preserving cultural heritage sites throughout the world with ...
GlobalFoundries has showcased a new technology that allows 3D stacking of chips for use in mobile and consumer applications. The company uses the 20nm-LPM process technology to manufacture its first functional 20nm silicon wafers with ...
Tags: mobile, applications, chips
Changyou Secures the Largest Exhibition Booth of ChinaJoy B TO B 2013 , Seeking an Overall Layout in the Online Game Industry . ChinaJoy 2013 will be opened at Shanghai New International Expo Center at the end of July. As China’s ...
Veeco Instruments Inc. (Nasdaq: VECO) announced today that CEA-Leti, a world-renowned research lab based in Grenoble, France, has selected Veeco’s TurboDisc® K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its ...
Gamers, designers and photographers have innovative treats in store when the Leap Motion 3D gesture-sensing computer interface is launched next month (May 13). The launch could be a watershed. Since last May, Leap Motion has shipped ...
Tags: 3D Gesture Sensing, Lights, Lighting
ARM and Cadence have announced the first Cortex-A57 processor test chip fabricated on TSMC’s 16nm finfet manufacturing process technology. According to the companies, this test chip resulted in several optimisations between ...
Tags: ARM, TSMC, Cortex Processor
STMicroelectronics is leading the Lab4MEMS ENIAC project to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched ...
Tags: ST, EU Mems Project, Electronics
LCD panel makers in Taiwan, Japan and Korea have been suffering. Despite the growing demand for LCDs the high number of panel makers and new competition from China has resulted in tough price competition for panel makers, to the point that ...
Tags: LED, LCD, Electrical, Electronics, LCD panel
Like Dent challenges the idea of elegance The chair Dent challenges the idea of the elegant and beautiful. It wants to be the anti-thesis of what is perfect. The dented surface provides a 3D experience but are implemented in regular ...
Tags: Furniture, Furnishing
Globalfoundries claims a breakthrough in 3D stacking of chips with the demonstration of functional 20nm silicon wafers with integrated through-silicon vias. The technique allows chips to be stacked on top of each other with circuit ...
Tags: Consumer Electronics, Electronics, Chip
More than 50 television models from LG Electronics are now rated on the EPEAT global registry for greener electronics, which expanded today to include televisions for the first time. The new environmental rating category recognizes ...
Tags: Consumer Electronics, LG
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that the research lab CEA-Leti in Grenoble, France, has selected Veeco’s TurboDisc K465i metal-organic chemical vapor deposition (MOCVD) ...
Tags: LED technology, LED, LEDs