Brewer Science Inc of Rolla, MO, USA, which provides thin-wafer-handling materials, processes and equipment, has unveiled the Apogee bonder for temporary wafer bonding applications. The firm says that this marks a milestone in leveraging ...
Tags: Electrical, Electronics, Industrial Equipment, Components
With silicon-on-insulator (SOI) business declining, 3D TSV stack implementation beginning, and the competitive environment changing, market research firm Yole Développement has released a new study 'Permanent Wafer Bonding for ...
Tags: Electrical, Electronics
The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. This latest generation tool is a further development of the very successful MA200 Compact platform, of which the 100th ...
Tags: Components, Tools, Hardware
Shorr Packaging, an industry leader in integrated, cost-effective packaging solutions, announces the opening of a new sales and distribution center in the greater Atlanta, Ga. area. This expansion allows the company to further develop sales ...
Austrian manufacturer of plastic products Borealis and UAE-based Borouge have jointly launched a new grade of BorPure high density polyethylene (HDPE) family for caps and closures. Made with Borealis' Borstar polyethylene (PE) ...
Tags: Borealis, HDPE Grade, Caps, Closures
Tokyo Pack is the showcase in which the most advanced packaging developments globally tend to make their debuts. At the last Tokyo Pack in 2012, Showa Aluminum Can Corporation showed off its colour changing can used by Asahi Breweries. ...
Tags: Packaging, Printing, Tokyo Pack
We have some exciting news for you: we’re launching a new publication this year! Each week, Yole Développement will publish @Micronews, the definitive source for the latest disruptive semiconductor applications and trends. ...
Borouge, a global provider of innovative plastic solutions is very upbeat on the Indian market, and expects a significant part of its global manufacturing capacity under-expansion to cater to the Indian market. In 2014 Borouge is ...
Tags: Wires, Cables, Electrical, Electronics
TSMC Solid State Lighting Ltd and Xiamen Topstar Co., Ltd. will announce their strategic cooperation at the 2013 Hong Kong International Lighting Fair (Autumn Edition). Inaugurating the cooperation, a series of lighting products were ...
Tags: Package-Free Pod, Lighting
Specialty packaging company CCL Industries has signed a contract to acquire the assets of German packaging solutions provider Advanced Packaging Films (APF) for about $9m. Following the transaction, APF will operate as a subsidiary of CCL ...
Tags: Advanced Packaging Films, CCL
CCL Industries Inc. (“CCL”), a world leader in specialty label and packaging solutions for global corporations, small businesses and consumers announced today that it has signed a binding agreement to acquire the assets of ...
Taiwan's packaging machinery industry has been developed over the decades by local companies using skills and know-how learned from overseas, initially with the aim of replacing imports. The industry went on to become an exporter, and many ...
Tags: Packaging Machine
On September 5, 14:00 - 14:30, Universal Instruments’ Advanced Process Lab (APL) presented Assembly Solutions for Wide IO Package-on-Package Applications at the SEMICON Taiwan TechXPOT. The presentation explored Package-on-Package ...
Tags: Universal, SEMICON Taiwan
Rudolph Technologies Inc of Flanders, NJ, USA, which makes defect inspection, process control metrology, and data analysis systems and software for manufacturing integrated circuits as well as flat-panel displays, solar cells and LEDs, has ...
Tags: Electrical, Electronics
Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its ...