A specialized packaging provider in the US has selected TrackX Holdings’ GAME for Supply Chain Management (SCM) platform to manage and optimize supply chain assets and related business processes. TrackX Holdings, based in Denver, ...
Tags: Trackx, SCM Solution, Packaging
Philips Photonics of Ulm, Germany - which provides vertical-cavity surface-emitting laser (VCSEL) technology for datacom, consumer and industrial applications - has completed ‘VIDaP’ (VCSEL Pilot Line for Illumination, Datacom ...
Kuka Robotics is showcasing packaging and palletizing solutions at this year’s Pack Expo event in Las Vegas, US. At the event, the company is exhibiting its robotic solutions, including KR 6 R900 Agilus robots. The company will ...
Tags: Kuka Robotics, packaging
The automotive LIDAR (light detection and ranging) system market is growing from $230m in 2016 to $2.5bn in 2026, with LIDAR semiconductor revenue rising from $103m to $1.8bn, according to a report by IHS Markit. The current generation of ...
Tags: semiconductor, cameras
Pro Mach’s subsidiary Edson is set to introduce new robotic mixed-product case packing solution at the Pack Expo in Las Vegas, US. The solution is cliamed to offer the speed and flexibility needed for e-commerce fulfillment and food ...
Tags: food packing, tray packer
Magna has unveiled MAX4, a fully integrated, customizable and scalable autonomous driving sensing and compute platform that can allow up to Level 4 autonomous driving capabilities in both urban and highway environments. MAX4 combines ...
Tags: Magna, autonomous driving sensing
Atomic layer deposition (ALD) thin-film technology firm Picosun Oy of Espoo, Finland has reported repeat sales of automated P-300BV vacuum batch production systems to major Asian discrete device manufacturers. Even if the 300mm wafer size ...
Tags: LED lighting, MEMS
Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) has launched the SKY66403-11, its newest 2.4GHz fully integrated RF front-end module (FEM), designed to support ZigBee, Thread and ...
Tags: Skyworks, Front-End Module
Tokyo-based Showa Denko K.K. (SDK) has expanded its product lineup of infrared light-emitting diode (IR-LED) chips, which are mainly used as parts of photo-couplers for gate drivers in power semiconductor modules and parts of sensors for ...
MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for ...
Tags: Die Bonder, Photonics
Japanese start-up company FOVE is offering a virtual reality (VR) headset that integrates eye tracking as a novel means of interaction. ChipLEDs made by Osram Opto Semiconductors GmbH of Regensburg, Germany provide the infrared illumination ...
For second-quarter 2017, POET Technologies Inc of San Jose, CA, USA — which has developed the proprietary planar optoelectronic technology (POET) platform for monolithic fabrication of integrated III-V-based electronic and optical ...
Tags: POET Technologies, sensors
Osram of Munich, Germany has made an investment (in the mid double-digit million euros range) to acquire a strategic 25.1% stake in LeddarTech Inc of Québec, Canada, which was founded in 2007 and has developed patented Leddar LiDAR ...
Tags: Osram, LiDAR sensing technology
German packaging company Gerhard Schubert GmbH will demonstrate its high-performance packaging machines at PackExpo 2017 trade fair to be held in Las Vegas from September 25 to 27. The company will display a new compact flow-wrapping ...
The KHS Group, a manufacturer of filling and packaging systems for the beverage, food and non-food industries, will launch a compact labeler, Innoket Roland 40, at Drinktec 2017 trade show to be held in Munich, Germany, from September 11 to ...
Tags: Compact Labeler, Spirits Bottlers