3D Integration articles & resources on Made-in-China.com

Fabless Silicon Photonics Firm Skorpios Acquires Manufacturer Novati

Oct 10, 2017

Fabless silicon photonics system-on-chip (SoC) company Skorpios Technologies Inc of Albuquerque, NM, USA has acquired Novati Technologies LLC, a semiconductor integration company with a fabrication plant in Austin, TX. Skorpios delivers ...

Tags: Fabless silicon photonics, MEMS sensors

Brewer Science, Arkema Partner to Develop High-Chi DSA Materials for Advanced Node Patterning

Jul 17, 2017

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers. Brewer Science indicated these new materials target ...

Tags: Brewer Science, Node Patterning

SüSS Microtec Launches XB8 Semi-Automated High-Force Wafer Bonder

Sep 18, 2015

SüSS MicroTec AG of Garching, near Munich, Germany, a supplier of equipment and process solutions for microstructuring in semiconductor and related markets, has launched the XB8 bonding platform. Designed for a wide range of bonding ...

Tags: SüSS MicroTec, Wafer bonding, semiconductor

The Tool Is Designed for High Volume Manufacturing

Apr 16, 2014

The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. This latest generation tool is a further development of the very successful MA200 Compact platform, of which the 100th ...

Tags: Components, Tools, Hardware

IBM Is Looking for Alternatives to CMOS Technology and Von Neumann Architecture

Jan 20, 2014

IBM is looking for alternatives to CMOS technology and Von Neumann architecture. Semiconductor packaging of integrated bipolar silicon is needed. In addition, 3D integration allows for strong I/O performance; 2.5D and improved materials are ...

Tags: I/O Performance, 3D Integration, IBM

Lectra Is Pleased to Announce The Success of Its Early-Adopter Program for Modaris 3D

May 24, 2013

Lectra, the world leader in integrated technology solutions dedicated to industries using soft materials—fabrics, leather, technical textiles and composite materials—is pleased to announce the success of its early-adopter ...

Tags: Fashion Industry, 3D Revolution

SPTS Has Reached a Milestone in Shipping Its 1000th Deep Reactive Ion Etch (DRIE) Module

May 9, 2013

Plasma etch, deposition and thermal processing equipment maker SPTS Technologies Ltd of Newport, Wales, UK (a Bridgepoint portfolio company) has reached a milestone in shipping its 1000th deep reactive ion etch (DRIE) module. Fundamental ...

Tags: SPTS, Electronics

MIRAGE Was Launched Recently with The Goal of Developing Interconnect Technology

Dec 24, 2012

MIRAGE - a new project supported by the Seventh Framework Programme (FP7), Information and Communication Technologies (ICT) of the European Commission (EC) - was launched recently with the goal of developing next-generation optical ...

Tags: optical interconnect technology, optical, optical interconnect speed

Intel Labs and ITRI Recently Co-Announced a Low Energy Experimental Memory Array

Dec 10, 2012

Taipei, Dec. 6, 2012 (CENS)--Intel Labs and the Taiwan government-backed Industrial Technology Research Institute (ITRI) recently co-announced a low energy experimental memory array that could significantly advance 3-D stacking and system ...

Tags: Intel Labs, ITRI, new array

3D Integration

Related Products