The new programme focuses on meeting IBM's technology requirements through its partners in the Semiconductor Research and Development Alliance TEL NEXX, a subsidiary of Tokyo Electron U.S. Holdings has signed a new multi-year ...
Tags: semiconductor research, 3D semiconductor packaging programme, IBM
US-based TEL NEXX, a wholly owned subsidiary of Tokyo Electron US Holdings, has announced that it entered into a pact with IBM for a new multi-year joint development program in 3D semiconductor packaging. According to TEL Nexx, as 3D ...
Tags: TEL NEXX, IBM, 3D semiconductor packaging