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Back Grinding
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AIT Develops a Series of Temporary Wax-Like Media
Oct 23, 2014AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of thinning applications, in particular for the dies and wafers of cell phones, cameras and tablets. ...
Tags: AI Technology, wax-like media
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Wafers and Substrates Are Thinned Down From as Much as 750um
Sep 9, 2014As devices such as cell phones, cameras, and tablets continue to shrink, there is also a big push to shrink the thickness of these devices, and hence the thickness of the dies and wafers, says AI Technology Inc (AIT) of Princeton Junction, ...
Tags: Bonding Wax, Back-Grinding
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