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Sun Chemical to Showcase Wide Product Portfolio for Printed Electronics at LOPEC 2018

Jan 23, 2018

Sun Chemical will showcase the latest offerings from its wide portfolio of solutions for printed electronics, displays, electroluminescent lighting, smart sensors, packaging, printed circuit boards and electronics manufacturing at LOPEC ...

Tags: Sun Chemical, LOPEC 2018

Mentor Introduces Xpedition High-Density Advanced Packaging Flow Solution

Jun 7, 2017

Siemens business unit Mentor has introduced a new solution for the design and verification of the existing IC package designs. The Mentor Xpedition High-Density Advanced Packaging (HDAP) flow solution can be used for rapid prototyping ...

Tags: Siemens, Packaging Flow

Intersil Unveils Single-Cell Battery Charger for Automotive Ecall Systems

Feb 13, 2017

Intersil has unveiled the ISL78693, a 3.6V single-cell battery charger that extends the life of Lithium Iron Phosphate (LiFePO4) batteries used in automotive emergency call (eCall) systems. The ISL78693 battery charger offers up to 4x ...

Tags: Intersil, Battery Charger

MACOM Launches Chip-Set for Short-Reach VCSEL-Based 100Gbps Onboard Optics Applications

Sep 21, 2016

MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has launched the MALD-37345, a quad 28G vertical-cavity ...

Tags: MACOM, MALD-37345, VCSEL driver

Cree Launches MHB-B High-Power Led to Lower System Cost for High-Performance Lighting

Aug 8, 2016

LED chip, lamp and lighting fixture maker Cree Inc of Durham, NC, USA has launched the XLamp MHB-B LED, a high-power LED that enables a more effective way to deliver lower system costs for high-lumen, high-efficiency applications designed ...

Tags: Cree LEDs, LED chip, High-Performance Lighting

PCB Players Turn to Compete in Car-Use PCB Market

Apr 18, 2016

Taiwan-based PCB players are pushing into car-use products as demand for PCs, smartphones and tablets has been weakening. Chin Poon and Tripod Technology, which have been operating in the car-use PCB market for a long time, are looking to ...

Tags: PCB Players, PCB Market

NI AWR Design Environment V12.01 Update Now Available

Oct 15, 2015

NI (formerly AWR Corp) of El Segundo, CA, USA has announced the availability of a new update to version V12 of NI AWR Design Environment, which targets designers of monolithic microwave integrated circuits (MMICs), radio-frequency ...

Tags: AWR, amplifier, antenna, rada, Visual System Simulator

USA Has Launched 2000W High-Power LED COB Products

May 28, 2015

LED lighting technology firm Flip Chip Opto Inc of Fremont, CA, USA has launched 2000W high-power LED chip-on-board (COB) products using its patented 3-Pad LED flip chips and Pillar Metal Core printed-circuit board (P-MCPCB) technologies. ...

Tags: Flip Chip Opto, LED Flip Chips, PCBs

PCB, FPCB Makers to Post Mixed Results for 2Q15

May 21, 2015

PCB and flexible PCB (FPCB) suppliers are expected to post mixed results for the second quarter of 2015 as orders from the iPhone 6 supply chain are expected to begin to subside and demand from the notebook sector will remain flag, ...

Tags: PCB, flexible PCB

Prophotonix Added Two New Visible Laser Diodes to Its Product Catalog

Feb 13, 2015

ProPhotonix Ltd of Salem, NH, USA, a designer and manufacturer LED illumination systems and laser diode modules for OEMs and medical equipment companies (as well as a distributor of laser diodes for Panasonic, Ushio, Osram, QSI, and Sony), ...

Tags: ProPhotonix, Visible Laser Diodes

Signal Integrity Concerns Moved From RF and Esoteric High-Speed Designs Into The Main

Jan 28, 2015

Over the years, signal integrity concerns have moved from RF and esoteric high-speed designs into the mainstream. Rare is the project these days that doesn’t have to consider transmission lines and controlled impedanceThe total ...

Tags: esoteric high-speed designs, transmission lines, Electrical

A Harvard University Spinoff Unveiled a 3D Printer

Jan 21, 2015

A Harvard University spinoff has unveiled a 3D printer that can print out devices with integrated electronic circuits. The Voxel8 3D printer uses two materials: PLA plastic for the body and enclosure of the device, as well as a highly ...

Tags: 3D printer, cloud-based software, Electrical

Microplastic Ocean Pollution, in Varying Concentrations, Everywhere in The World

Jan 6, 2015

Six years ago, the 5 Gyres Institute formed to answer a question the world had put in its too hard box. Marcus Eriksen, PhD, director of research for the 5 Gyres Institute, explained, “The 5 Gyres Institute’s work began six ...

Tags: Plastic, Oceans, Packaging

Taiwan-Based Eiso Will Be Listed on The Taiwan OTC Stock Market

Dec 9, 2014

Taiwan-based Eiso Enterprise will be listed on the Taiwan over-the-counter (OTC) stock market at an initial price of NT$32 (US$1.03) per share on December 23, according to the company. Eiso specializes in the manufacture of niche-market ...

Tags: stock market, LED backlight, LED TVs, Lights

Demand for High-End Packaging to Stay Strong in Q4

Nov 10, 2014

Semiconductor materials suppliers expect demand for high-end packaging to remain strong and buoy their sales in the fourth quarter of 2014. Ampoc Fareast and Niching Industrial have both indicated clear order visibility through the end of ...

Tags: Semiconductor, Packaging

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