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Bericap to Present Product Innovations at Hispack 2018 Event
Mar 26, 2018Bericap is planning to present product innovations at 2018 Hispack Packaging, Process & Logistics trade fair to be held in Barcelona from 8-11 May. The company will be presenting itself with a clear focus on the vast range of services and ...
Tags: Bericap, Hispack Packaging
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Toyo Printing Inks to Showcase New Packaging Solutions at Eurasia Packaging
Oct 24, 2017Toyo Printing Inks plans to exhibit its latest innovations in food and non-food packaging solutions during the Eurasia Packaging Fair 2017 in Istanbul, Turkey. The solutions to be demonstrated by the printing ink manufacturer are claimed ...
Tags: Toyo Printing, Packaging
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Ring Container Technologies Completes Innovation Project with Conagra Brands
Sep 28, 2017Ring Container Technologies, a leader in the product packaging and plastic container manufacturing industry, announced its collaboration with Conagra Brands on an aerosol-to-plastic conversion for PAM Cooking Spray, which is now available ...
Tags: Ring Container, plastic container
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Smurfit Kappa Holds Eighth Innovation Event in Paris
Jul 18, 2017Corrugated packaging firm Smurfit Kappa has held its eighth Innovation Event this year in Paris, France. Over 250 customers came to the “Packaging and Perspectives” event which took a look at how packaging will be affected by ...
Tags: Corrugated packaging, packaging
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ebeam Technologies Adds Inx International to Its Portfolio
May 17, 2017ebeam Technologies, a developer and manufacturer of electron beam (EB) curing systems, has added inks producer INX International to its portfolio. The companies have formed a partnership, which will boost the development of new ebeam ...
Tags: packaging, digital print
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Berlin Packaging Receives Multiple Gold Medals at Recent Packaging Industry Awards
May 17, 2017Berlin Packaging, a supplier of plastic, glass, and metal containers and closures, has announced that it received a record number of gold medals at the NACD (National Association of Container Distributors) 2017 Packaging Awards. Four of ...
Tags: Berlin Packaging, Packaging
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PAC Machinery Launches New Vertrod Ps Med Validatable Medical Sealer
Dec 20, 2016US-based PAC Machinery has introduced its new Vertrod PS Med validatable medical sealer at Pack Expo / Pharma Expo 2016. The sealer, which was designed for medical applications, will be used for heavy-duty sealing of wide materials that ...
Tags: PAC Machinery, sealer
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UFP Technologies Reports Q2 Results
Aug 8, 2016UFP Technologies, a designer and custom converter of foams, plastics, composites, and natural fiber materials, reported net income of $2.7m or $0.38 per diluted common share outstanding for its second quarter ended 30 June 2016, a 20.4% ...
Tags: UFP Technologies, biotech, custom converter
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T. H. E. M. Expands Operations with New Contract Packaging Facility
Aug 3, 2016Technical Help in Engineering and Marketing (T.H.E.M.), a leading provider of flexible packaging solutions, recently announced the opening of its new 20,000ft2 facility for non-food contract packaging. Expected to be operational in ...
Tags: flexible packaging, packaging
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Sealed Air Selects Esko's Equinox to Improve Packaging Efficiencies
May 25, 2016Sealed Air (SEE) is the latest forward-thinking operation to invest in Esko Equinox to streamline its print production process to enhance its business offering. Sealed Air logo SEE was founded in 1957. Today, there are three divisions: ...
Tags: Sealed Air, Packaging
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Macfarlane Launches Packaging Innovation Lab In UK
Mar 21, 2016Macfarlane Packaging, a UK-based distributor of protective packaging materials, has launched the new packaging innovation lab in order to help create bespoke, cost effective protective packaging solutions for customers. Located in ...
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Photonic Integrated Circuit Market to Grow at 25.3% CAGR to $1.3bn in 2022
Nov 19, 2015The photonic integrated circuit (PIC) market was $0.19bn in 2013 and is expected to increase at a compound annual growth rate (CAGR) of 25.3% from 2015 to $1.3bn in 2022, according to the new market report 'Photonic IC Market - Global ...
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Altera and TSMC Work Together to Bring Packaging Technology to Altera
Apr 24, 2014Altera and TSMC announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs. Altera is the first company to adopt this technology ...
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Package Design Is an Essential Element of Branding
Dec 25, 2013Package design is an essential element of branding in the cosmetics, personal and home care industry and a vital part of the product development process. To ensure success, each product often requires specialized packaging to promote the ...
Tags: coding equipment, coding solutions, package design, brand image
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Bemis Performance Packaging Announces Launch of Bemis TITAN Beverage Shrink Films
Aug 26, 2013Bemis Performance Packaging, a leading supplier of flexible packaging and labeling solutions, announces the launch of Bemis TITAN brand beverage shrink films and shrink labels. Bemis TITAN shrink films and labels are designed to enhance ...
