Semiconductor packaging articles & resources on Made-in-China.com

Kulicke & Soffa Acquires Dutch Packaging Company Liteq

Jul 12, 2017

Semiconductor packaging and electronic assembly solutions provider Kulicke & Soffa (K&S) has expanded its advanced packaging presence with the acquisition of privately held Dutch packaging company Liteq. Financial terms of the acquisition ...

Tags: Semiconductor packaging, packaging

Kulicke & Soffa to Exhibit New Solutions at SMT Hybrid Packaging 2017

May 16, 2017

Kulicke & Soffa Industries is set to showcase its new packaging solutions at the SMT Hybrid Packaging trade show in Germany. The event will take place from 16 to 18 May in Nuremberg. Kulicke & Soffa will showcase its products such as ...

Tags: Hybrid Packaging, Packaging

Kulicke & Soffa Opens Process and Applications Laboratory at Netherlands Facility

Apr 18, 2017

Semiconductor packaging solutions provider Kulicke & Soffa (K&S) has opened a new process and applications laboratory at its facility in the City of Eindhoven in the Netherlands. The 180m2 laboratory and adds to the company’s ...

Tags: packaging, refining packaging

RJR Ships 10 Millionth Air-Cavity Plastic Package, Highlighting Migration From Air-Cavity Ceramic Packaging for RF

May 20, 2016

RJR Technologies Inc of Oakland, CA, USA, a developer and high-volume manufacturer of air-cavity plastic (ACP) semiconductor packaging for RF and microwave markets, has shipped over 10 million ACP packages, reflecting the increasing use of ...

Tags: microwave packaging, Plastic Package

Cal-Comp to Add New Plastic Injection Production Line in Brazil

Dec 8, 2015

Cal-Comp, a subsidiary of New Kinpo Group (NKG), and a leading global electronics manufacturing services (EMS) company, is to expand its presence in South America, by opening a new factory and adding a new plastic injection production line ...

Tags: Cal-Comp, Plastic Injection

Niching 2014 Profits Set a Record in 3-Year

Apr 1, 2015

IC packaging material and tool distributor Niching Industrial has posted net profits of NT$61.37 million (US$1.96 million) in 2014, up 116% on year and hitting a 3-year high. The earnings translated into a net EPS of NT$1.57. Niching ...

Tags: IC packaging, packaging material, tool distributor

The Cambridge Nanotherm Intends to Commercialize Its Nanoceramic Technology

Aug 12, 2014

The UK startup Cambridge Nanotherm has appointed a new chief executive. The move signals the company's intention to commercialize its nanoceramic technology that converts aluminum into a dielectricThe insulating material between the plates ...

Tags: Electrical, Electronics

IBM Is Looking for Alternatives to CMOS Technology and Von Neumann Architecture

Jan 20, 2014

IBM is looking for alternatives to CMOS technology and Von Neumann architecture. Semiconductor packaging of integrated bipolar silicon is needed. In addition, 3D integration allows for strong I/O performance; 2.5D and improved materials are ...

Tags: I/O Performance, 3D Integration, IBM

Reflex Is Showcasing High-Speed Parallel Channel

Mar 21, 2013

At the Optical Fiber Communication/National Fiber Optics Engineers Conference (OFC/NFOEC 2013) in Anaheim (19–21 March), California-based Reflex Photonics, which provides high-speed optical connectivity solutions for semiconductor ...

Tags: Reflex, duplex embedded transceivers, Optical Fiber

Asahi Glass Co. Has Made a $2.1 Million Investment in Triton Microtechnologies

Mar 14, 2013

Asahi Glass Co (AGC) has made a $2.1 million investment in Triton Microtechnologies. Triton is based in Arizona, USA and owns via-fill technology for interposer substrate, to realise next-generation semiconductor packaging products using ...

Tags: AGC, investment, Triton Microtechnologies, ultra-thin glass

AGC Contributes to The Acceleration of Next-Generation Semiconductor Packaging Development

Mar 14, 2013

AGC (Asahi Glass Co., Ltd.; Head Office: Tokyo; President & CEO: Kazuhiko Ishimura) has made an investment totaling USD 2.1 million in Triton Microtechnologies, Inc. (Head Office: Arizona, U.S.), which owns cutting-edge via-fill technology ...

Tags: AGC, Triton Microtechnologies, glass

Asahi Glass and Nmode Solutions Have Formed Triton Micro Technologies to Develop Via-Fill

Mar 13, 2013

Asahi Glass and nMode Solutions of Arizona have formed a semiconductor packaging company called Triton Micro Technologies to develop via-fill technology using ultra-thin glass to make interposers for 2.5D and 3D semiconductors. "The ...

Tags: Asahi Glass, nMode Solutions of Arizona, semiconductor packaging

AGC Has Made an Investment Totaling USD 2.1 Million in Triton Microtechnologies,Inc.

Mar 13, 2013

AGC (Asahi Glass Co., Ltd.; Head Office: Tokyo; President & CEO: Kazuhiko Ishimura) has made an investment totaling USD 2.1 million in Triton Microtechnologies, Inc. (Head Office: Arizona, U.S.), which owns cutting-edge via-fill technology ...

Tags: AGC, glass, ultra-thin glass

PRUF LED Has Installed a PYRAMAX 125A at Its New Cutting-Edge

Dec 14, 2012

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that PRUF LED has installed a PYRAMAX™ 125A at its new cutting-edge, ...

Tags: BTU International, LED, PYRAMAX, alternative energy

TEL NEXX Signed an Agreement with IBM to Develop a 3D Semiconductor Packaging Programme

Dec 11, 2012

The new programme focuses on meeting IBM's technology requirements through its partners in the Semiconductor Research and Development Alliance TEL NEXX, a subsidiary of Tokyo Electron U.S. Holdings has signed a new multi-year ...

Tags: semiconductor research, 3D semiconductor packaging programme, IBM

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